A mask, a mask assembly including a mask, and a substrate transfer apparatus including a mask. According to an embodiment, a mask includes a frame including an opening, accommodation structure disposed on the frame and including an accommodation space shielded from an outside, and a sensor disposed in the accommodation space.

A mask, a mask assembly including a mask, and a substrate transfer apparatus including a mask. According to an embodiment, a mask includes a frame including an opening, accommodation structure disposed on the frame and including an accommodation space shielded from an outside, and a sensor disposed in the accommodation space.

The present disclosure provides a secondary imaging optical lithography method and apparatus. The method includes: contacting a lithography mask plate with a flexible transparent transfer substrate closely, the flexible transparent transfer substrate comprising a first near-field imaging structure having a photosensitive layer; irradiating the photosensitive layer through the lithography mask plate with a first light source, so as to transfer a pattern of the lithography mask plate to the photosensitive layer; coating a device substrate for fabricating devices with a photoresist; contacting the flexible transparent transfer substrate with the photoresist-coated device substrate closely; irradiating the device substrate through the flexible transparent transfer substrate with a second light source, so as to transfer a pattern of the photosensitive layer to the photoresist of the device substrate; and developing the device substrate comprising an exposed photoresist, so as to obtain a device pattern conforming to the pattern of the lithography mask plate.

A reflective mask blank has a substrate 10; a multilayer reflective film 20 that is provided on the substrate 10 and reflects exposure light; a protective film 50 including a metal oxide film 51 provided on the multilayer reflective film 20; and an absorber film 70 that is provided on the protective film 50 and absorbs exposure light. The multilayer reflective film 20 is configured such that a Mo layer and a Si layer are alternately stacked and a layer on a side farthest from the substrate 10 is the Si layer. The metal oxide film 51 is configured such that an oxygen content in a layer on a side far from the substrate 10 is higher than the oxygen content in a layer on a substrate side.

Provided is a method of providing a patterned layer (50). The method comprises providing (2, 3A, 3B) a substrate (10) having a surface (11) to which a compound is applied. The compound has at least one condensable group which is reactive with surface groups on the surface of the substrate by condensation reaction. The compound also has a basic group for accepting protons. A layer of a polycondensable imprinting composition (30) is applied (4) onto the layer of the compound. The imprinting composition layer is imprinted (5A, 5B, 5C) with a patterned stamp. During the imprinting, polycondensation of the imprinting composition leads to forming of the patterned layer. Further provided is the patterned layer itself, as well as an optical element and an etch mask, each of which comprises the patterned layer.

Provided is a method of providing a patterned layer (50). The method comprises providing (2, 3A, 3B) a substrate (10) having a surface (11) to which a compound is applied. The compound has at least one condensable group which is reactive with surface groups on the surface of the substrate by condensation reaction. The compound also has a basic group for accepting protons. A layer of a polycondensable imprinting composition (30) is applied (4) onto the layer of the compound. The imprinting composition layer is imprinted (5A, 5B, 5C) with a patterned stamp. During the imprinting, polycondensation of the imprinting composition leads to forming of the patterned layer. Further provided is the patterned layer itself, as well as an optical element and an etch mask, each of which comprises the patterned layer.

Provided is a method of manufacturing a deposition mask frame assembly, the method including placing and welding a support stick mask and a gap stick mask on a frame, and joining edges of a deposition stick mask with the frame by welding while the deposition stick mask is tensioned in a longitudinal direction of the X-axis direction and at the same time, adhesively tensioned in the Y-axis direction, thereby preventing wrinkles due to the tensioning of the deposition stick mask to manufacture a fine and high-quality deposition mask frame assembly.

Provided is a method of manufacturing a deposition mask frame assembly, the method including placing and welding a support stick mask and a gap stick mask on a frame, and joining edges of a deposition stick mask with the frame by welding while the deposition stick mask is tensioned in a longitudinal direction of the X-axis direction and at the same time, adhesively tensioned in the Y-axis direction, thereby preventing wrinkles due to the tensioning of the deposition stick mask to manufacture a fine and high-quality deposition mask frame assembly.

An lithographic reticle may be formed comprising a transparent substrate, a substantially opaque mask formed on the transparent substrate that defines at least one exposure window, wherein the at least one exposure window has a first end, a first filter formed on the transparent substrate within the at least one exposure window and abutting the first end thereof, and a second filter formed on the transparent substrate within the at least one exposure window and abutting the first filter, wherein an average transmissivity of the first filter is substantially one half of a transmissivity of the second filter. In another embodiment, the at least one exposure window includes a third filter abutting the second end and is adjacent the second filter. Further embodiments of the present description include interconnection structures and systems fabricated using the lithographic reticle.

An lithographic reticle may be formed comprising a transparent substrate, a substantially opaque mask formed on the transparent substrate that defines at least one exposure window, wherein the at least one exposure window has a first end, a first filter formed on the transparent substrate within the at least one exposure window and abutting the first end thereof, and a second filter formed on the transparent substrate within the at least one exposure window and abutting the first filter, wherein an average transmissivity of the first filter is substantially one half of a transmissivity of the second filter. In another embodiment, the at least one exposure window includes a third filter abutting the second end and is adjacent the second filter. Further embodiments of the present description include interconnection structures and systems fabricated using the lithographic reticle.