Disclosed is a workpiece processing apparatus that performs a predetermined processing on a workpiece. The workpiece processing apparatus includes: a workpiece table configured to place the workpiece thereon; a processor configured to process the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the processor; a position measuring device configured to measure a position of the movement mechanism; a detector configured to detect a position of the workpiece placed on the workpiece table; and a corrector configured to calculate a positional correction amount of the workpiece table based on a measurement result of the position measuring device and a detection result of the detector.

Wafer alignment with restricted visual access has been disclosed. In an example, a method of processing a substrate for fabricating a solar cell involves supporting the substrate over a stage. The method involves forming a substantially opaque layer over the substrate. The substantially opaque layer at least partially covers edges of the substrate. The method involves performing fit-up of the substantially opaque layer to the substrate. The method involves illuminating the covered edges of the substrate with light transmitted through the stage, and capturing a first image of the covered edges of the substrate based on the light transmitted through the stage. The method further includes determining a first position of the substrate relative to the stage based on the first image of the covered edges. The substrate may be further processed based on the determined first position of the substrate under the substantially opaque layer.

An imprint apparatus for forming a pattern of an imprint material on a substrate using a mold having a mesa including a pattern region where a pattern and a mark are formed. The apparatus includes an alignment optical system which includes an illumination system configured to illuminate the mark with illumination light and a detecting system configured to detect an image of the mark illuminated by the illumination system. The illumination system includes a limiter configured to limit incidence of the illumination light to a side of the mesa, a ridge line of the mesa, and an outer region of the side.

Disclosed is a substrate, associated patterning device and a method for measuring a position of the substrate. The method comprises performing an alignment scan of an alignment mark to obtain simultaneously: a first measurement signal detected in a first measurement channel and a second measurement signal detected in a second measurement channel. The first and second measurement signals are processed by subtracting a first direction component of the first measurement signal from a first direction component of the second measurement signal to obtain a first processed signal, the first direction components relating to said first direction. The position of an alignment mark is determined with respect to the first direction from the first processed signal.

In a beam irradiation apparatus in which a movable body holds an object, a mark detection system detects a first mark on the movable body while moving the movable body in a first direction and changing an irradiation position of a measurement beam in the first direction, the mark detection system detects a second mark while moving the movable body in the first direction and changing the irradiation position of the measurement beam in the first direction, a controller controls a position of the movable body in a second direction intersecting the first direction during a time period between the detection of the first mark and the detection of the second mark, and the controller controls the movement of the movable body to adjust a positional relation between the object on the movable body and a processing beam, based on results of the detection of the first and second marks.

A semiconductor device capable of improving the quality of a pixel region, an electronic apparatus including the semiconductor device, and a method for manufacturing the semiconductor device are to be provided. The present technology provides a semiconductor device that includes: a first substrate in which a pixel region including a pixel having a photoelectric conversion unit is formed; and a second substrate in which a logic circuit that processes a signal output from the pixel region is formed, the first substrate and the second substrate being stacked. In the semiconductor device, at least one of marks including a mark to be used in an exposure process during the manufacture of the semiconductor device and/or a mark to be used in an inspection process for the semiconductor device is formed in a first region that is a region between a first scribe region that is a peripheral portion of the first substrate and the pixel region and/or in a second region that is a region between a second scribe region that is a peripheral portion of the second substrate and a region corresponding to the pixel region in the second substrate.

The present application provides a display panel test method and a display panel test device. The display panel test method automatically searches for an alignment mark of a display panel. After the alignment mark is automatically found, a position of the alignment mark can be adjusted automatically. The alignment mark of the display panel can also be adjusted manually when the position of the alignment mark of the display panel cannot be automatically adjusted. Therefore, there is no need to conduct monitoring by manpower. After the alignment mark is found, there is no need to remove the display panel.

Provided is a method of manufacturing a semiconductor device, including providing a substrate including a first region and a second region; forming an alignment mark in the substrate in the second region; forming a material layer on a first surface of the substrate in the first region and the second region; introducing heteroatoms into the substrate in the second region from a second surface of the substrate; and reacting the heteroatoms with the substrate to form a dielectric layer overlapping the alignment mark in the substrate in the second region.

An alignment mark includes a first alignment marker located on a first surface of a substrate and a second alignment marker located on a second surface of the substrate. The second alignment marker is arranged to be matched with the first alignment marker, and capable of representing a process variation between the second alignment marker and the first alignment marker.

According to one embodiment, a pattern forming method includes forming a resist film including a first core material pattern and a second core material pattern, on a first film laminated on a substrate; forming a second film at least on sidewalls of the first and second core material patterns; removing the first core material pattern while not removing the second core material pattern and the second film; and processing the first film by using, as a mask, the second core material pattern and the second film.