A robot is configured to assist an end-user with creative tasks. While the end-user modifies the work piece, the robot observes the modifications made by the end-user and determines one or more objectives that the end-user may endeavor to accomplish. The robot then determines a set of actions to perform that assist the end-user with accomplishing the objectives.

In one embodiment, a system includes a wafer handling system, processing components, a controller, a virtual assistant, a natural language processing (NLP) engine, and a data-analytics engine. The wafer handling system is configured to hold one or more wafers for processing. The processing components is configured to physically treat the one or more wafers. The controller is configured to operate the processing components. The virtual assistant, in communication with the NLP engine, is configured to receive a user query from a user, understand an intent or context of the user query, and provide a context-specific response to the user query. The data-analytics engine is configured to generate and provide analytical data relating to the user query based on data collected from a plurality of data sources via one or more communication protocols.

A semiconductor machine system comprises a plurality of working chambers, wherein the working chambers process materials separately; a control host coupled to the plurality of working chambers, comprising: a main control module coupled to the plurality of working chambers; an analog control module coupled to the plurality of working chambers, and the analog control module is detachably coupled to one or more external devices by serial interface coupling; a digital control module coupled to the plurality of working chambers, and the main control module, the analog control module and the digital control module are coupled to each other; and a plurality of operating units coupled to at least one of the main control module, the analog control module and the digital control module, respectively, to control the plurality of working chambers for processing the materials by the main control module, the analog control module and the digital control module.

In production management systems, management devices includes a management device of a pre-process which adds a hash value of a production condition information received from a preceding process and a hash value calculated from the production condition information of the pre-process to calculate a first hash value and transmit the production condition information of the pre-process and the first hash value to a management device of a current process, and the management devices includes a management device of a current process which calculates a second hash value from production condition information received, calculates a third hash value obtained by subtracting the second hash value from the first hash value.

The present disclosure relates to a cosmetic manufacturing device and a discharge information determination method for the cosmetic manufacturing device, wherein the device and method provide a method for determining discharge information for providing customized cosmetics. The method comprises the steps of: determining a target color; determining a coverage level; determining a texture; and determining discharge information on the basis of the target color, the coverage level, and the texture, wherein the step for determining the discharge information may include a step for determining cartridges of interest such that the cartridge discharging a cosmetic material varies according to the coverage level even if the target color is the same.

A production management device, such as a production management computer, determines a production sequence of plural types of substrates in order to produce the substrates consecutively on a product type-by-type basis by using a component mounter including component supply devices. The production management device includes a main control unit for determining a production sequence of substrates such that, where a time from start to completion of off-line setup of all the component supply devices to be used for a single product type of substrate is defined as an off-line setup time, a sum of the off-line setup times for two product types of substrates to be consecutively produced is balanced over an entire period of consecutive production.

A processing system (10) and corresponding method (158) are provided for processing workpieces (WP), including food items, to cut and remove undesirable components from the food items and/or portion the food items while being conveyed on a conveyor system (12). An X-ray scanning station (14) is located on an upstream conveyor section (20) to ascertain size and/or shape parameters of the food items as well as the location of any undesirable components of the food items, such as bones, fat or cartilage. Thereafter the food items are transferred to a downstream conveyor (20) at which is located an optical scanner (102) to ascertain the size and/or shape parameters of the food items. The results of the X-ray and optical scanning are transmitted to a processor (18) to confirm that the food item scanned by the optical scanner is the same as that previously scanned by the X-ray scanner. Once this identity is confirmed, if required, the data from the X-ray scanner is translated or transformed onto the data from the optical scanner. Such translation may include one or more of the shifting of the food items in the X and/or Y direction, rotation of the food item, scaling of the size of the food item, and sheer distortion of the food item. Next, the location of the undesirable material within the food item is mapped from the X-ray scanning data onto the optical scanning data. Thereafter, the undesirable material is removed by a cutter(s) (28). The food item may also (or alternatively) been portioned by the cutter(s) (28).

A system includes a wafer shape metrology sub-system configured to perform one or more shape measurements on post-bonding pairs of wafers. The system includes a controller communicatively coupled to the wafer shape metrology sub-system. The controller receives a set of measured distortion patterns. The controller applies a bonder control model to the measured distortion patterns to determine a set of overlay distortion signatures. The bonder control model is made up of a set of orthogonal wafer signatures that represent the achievable adjustments. The controller determines whether the set of overlay distortion signatures associated with the measured distortion patterns are outside tolerance limits provides one or more feedback adjustments to the bonder tool.

A method to set up the parameters of solder paste screen printer while in a new product introduction (NPI). The method includes establishing a solder-printing database of a predetermined product and a database of different specifications of products, and training a first prediction model by reference to a solder paste screen printer (SPSP) and a solder paste inspection (SPI) based on the solder-printing database. A second prediction model is trained by reference to the SPI based on the database of different products. The method further includes predicting parameters for products with different specifications under multiple sets of printing parameters based on the first and second prediction models. An objective function based on the predicted measurements is established, and a specification of a product and a printing expectation parameters are input to the objective function for outputting many sets of printing-suggestion parameters of the new product.

The present disclosure provides a wafer repair method, system, apparatus and device, and a storage medium, relating to the field of semiconductor devices. The method includes: a laser equipment acquires test data for repairing a predetermined wafer; the laser equipment sending the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; and the laser equipment obtaining the repair data in the predetermined format to repair the predetermined wafer.