An encoder apparatus includes a detection unit, a scale disposed to oppose the detection unit and relatively rotatable with respect to the detection unit, and a processor configured to process an output signal output from the detection unit to obtain a relative position of the scale with respect to a standard position and thus detect an absolute position of the scale. The processor is configured to execute a setting process in which a position where a deviation amount of the scale in a predetermined direction with respect to a rotation axis is equal to or smaller than a threshold value is set as the standard position, the deviation amount changing in accordance with relative rotation of the scale with respect to the detection unit.

A grinding machine and a method for grinding large crankshafts are disclosed. During pre-grinding, steady-rest seats are ground, and a plurality of steady rests are placed against them. Synchronous electric drives drive the crankshaft at both ends. A desired shape is produced by interpolating motion of a first grinding disk about CNC-controlled X and Z axes and about a WK pivot axis. The grinding disk is a CBN grinding disk with a width less than the axial length of the main journals and crankpins of the crankshaft. Diameters are measured along the axial length of the main journals and/or crankpins by an in-process device. The drives for the X1, Z1, and WK axes are controlled in an interpolating manner on the basis of the measurements to achieve the desired shape.

A grinding machine and a method for grinding large crankshafts are disclosed. During pre-grinding, steady-rest seats are ground, and a plurality of steady rests are placed against them. Synchronous electric drives drive the crankshaft at both ends. A desired shape is produced by interpolating motion of a first grinding disk about CNC-controlled X and Z axes and about a WK pivot axis. The grinding disk is a CBN grinding disk with a width less than the axial length of the main journals and crankpins of the crankshaft. Diameters are measured along the axial length of the main journals and/or crankpins by an in-process device. The drives for the X1, Z1, and WK axes are controlled in an interpolating manner on the basis of the measurements to achieve the desired shape.

A method for correcting the processing path of a robot-guided tool for processing at least one component, wherein: a target position for a plurality of points of a target processing path is specified; from the specified points, points to be corrected are selected; the actual position for the selected points to be corrected is measured or detected on at least one component to be processed; and the processing path corresponding to the measured or detected actual position of the points of the component to be processed is correspondingly corrected. The method is suitable, for example, for welding a component into a borehole using a laser beam, wherein the processing path of the laser beam is corrected so as to correspond to the contour of the component.

A method for correcting the processing path of a robot-guided tool for processing at least one component, wherein: a target position for a plurality of points of a target processing path is specified; from the specified points, points to be corrected are selected; the actual position for the selected points to be corrected is measured or detected on at least one component to be processed; and the processing path corresponding to the measured or detected actual position of the points of the component to be processed is correspondingly corrected. The method is suitable, for example, for welding a component into a borehole using a laser beam, wherein the processing path of the laser beam is corrected so as to correspond to the contour of the component.

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.

A machining program creating device that calculates a movement command indicating a tool path based on the machining program including the machining cycle command includes machining region calculating means for calculating a machining region based on a machining condition and a finished shape specified by the machining cycle command, movement command calculating means for calculating the movement command based on the machining condition specified by the machining cycle command, and the machining region calculated by the machining region calculating means, and machining program creating means for creating a machining program without a machining cycle command, based on an unmachined workpiece shape and the finished shape specified by the machining cycle command, the machining region calculated by the machining region calculating means, and the movement command calculated by the movement command calculating means.

A machining program creating device that calculates a movement command indicating a tool path based on the machining program including the machining cycle command includes machining region calculating means for calculating a machining region based on a machining condition and a finished shape specified by the machining cycle command, movement command calculating means for calculating the movement command based on the machining condition specified by the machining cycle command, and the machining region calculated by the machining region calculating means, and machining program creating means for creating a machining program without a machining cycle command, based on an unmachined workpiece shape and the finished shape specified by the machining cycle command, the machining region calculated by the machining region calculating means, and the movement command calculated by the movement command calculating means.

A control device of a machine tool includes a position controller and a model of a position-controlled axis. The position controller receives a position setpoint value, a corresponding actual position value and a compensation value; determines therefrom a resulting value; determines based on the resulting value an actuating signal; and outputs the actuating signal to the position-controlled axis. The position and/or the orientation of the tool relative to the workpiece are adjusted based on the actuating signal. A sequence of successive control errors is stored, in a storage device and read out sequentially in accordance with a sequence of the position setpoint values and supplied to the model. The model determines from the read-out control error a respective compensation value which is then supplied to the position controller, while simulating the mechanically dynamic behavior of the position-controlled axis.