A prognostic and health management system for precision ball grinding machines includes: a detector connected to a first and a second grinding discs; and a central processing module including a determining unit, a historical data recording unit, a timing unit, and an alarm unit. The detector is connected to the determining unit, detects data of the two grinding discs, and sends the data to the determining unit, the determining unit compares data in the historical data recording unit to determine whether the first and second grinding discs are abnormal, if there is an abnormality, the alarm unit releases a warning signal, if the determining unit determines that there is no abnormality, the timing unit records a grinding time of the first and second grinding discs, and based on a comparison of the past records, the alarm unit releases a warning signal after a predetermined time has elapsed.

A grinding machine and a method for grinding large crankshafts are disclosed. During pre-grinding, steady-rest seats are ground, and a plurality of steady rests are placed against them. Synchronous electric drives drive the crankshaft at both ends. A desired shape is produced by interpolating motion of a first grinding disk about CNC-controlled X and Z axes and about a WK pivot axis. The grinding disk is a CBN grinding disk with a width less than the axial length of the main journals and crankpins of the crankshaft. Diameters are measured along the axial length of the main journals and/or crankpins by an in-process device. The drives for the X1, Z1, and WK axes are controlled in an interpolating manner on the basis of the measurements to achieve the desired shape.

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.

A mineral processing system featuring a controller having a signal processor or processing module configured to: receive signaling containing information about a relationship between multiple particle size measurements of different measured particles having different measured particle sizes flowing in a hydrocyclone classifier overflow stream sensed by at least one particle size measurement device arranged on a hydrocyclone classifier overflow pipe of at least one hydrocyclone in a hydrocyclone battery, and about a floatable fraction that defines a particle size range of different floatable particle sizes of different floatable particles that can be recovered by the at least one hydrocyclone in the hydrocyclone battery; and determine corresponding signaling containing information to control a ground product size of ore having ground particles provided to the at least one hydrocyclone in the hydrocyclone battery, based upon the signaling received.

This disclosure includes methods and systems for producing ophthalmic lenses. Some methods include identifying a plurality of zones within a spatial representation of a lens blank, selecting, for each of the zones, one or more parameters for producing the lens, and producing the lens by removing material from the lens blank according to the one or more parameters of each of the zones.

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.

A grinding circuit comprises a grinding mill having a shaft in a grinding chamber, a cyclone for receiving circuit feed material and for feeding said circuit feed material further in the grinding circuit, and monitoring devices. The grinding mill process comprises pumping circuit feed material from a feed tank to the cyclone upstream of the mill, and pumping the circuit feed material forming slurry into the grinding mill for grinding the slurry into finer particles. The method of controlling the grinding mill process comprises monitoring at least one operational parameter, and controlling particle fineness online by adjusting at least one of the following operational parameters: flow rate of the circuit feed material, density of the circuit feed material, shaft speed, filling rate in the grinding mill, milling density and retention time.

An edging method is provided, comprising: providing an edging apparatus comprising at least one sensor configured to detect a distance from the sensor to the edge to be ground; providing a workpiece having an edge to be ground; setting a base value of the distance; detecting a variation value, the variation value is a difference between a present distance from the sensor to the edge to be ground during grinding and the base value; and regulating a grinding feed amount of the edging apparatus according to the variation value. An edging apparatus is further provided.

The invention relates to a method for controlling an automated orbital sander, in which method an electrically powered orbital sander is moved around automatically, at constant pressure, over the surface of an object, along at least one predefined sanding path so as to perform sanding, characterized in that the instantaneous power consumed by the sander along the sanding path is measured and in that the measurement thus taken is processed in order to deduce therefrom information regarding the level of abrasion along said path and/or to detect any sanding incident that has occurred along the latter.

A mineral processing system featuring a controller having a signal processor or processing module configured to: receive signaling containing information about a relationship between multiple particle size measurements of different measured particles having different measured particle sizes flowing in a hydrocyclone classifier overflow stream sensed by at least one particle size measurement device arranged on a hydrocyclone classifier overflow pipe of at least one hydrocyclone in a hydrocyclone battery, and about a floatable fraction that defines a particle size range of different floatable particle sizes of different floatable particles that can be recovered by the at least one hydrocyclone in the hydrocyclone battery; and determine corresponding signaling containing information to control a ground product size of ore having ground particles provided to the at least one hydrocyclone in the hydrocyclone battery, based upon the signaling received.