An automatic component fabrication system, for use in fabricating a component, includes a control system having a memory that includes a computerized model of the component to be fabricated. A first monitoring system including a first illumination device and at least one camera is communicatively coupled to the control system and is configured to determine a position of the material at a first location. A cutting system is communicatively coupled to the control system and is configured to cut the component from a sheet of material based on the determined position and the computerized model. The automatic component fabrication system also includes a second monitoring system including a second illumination device and at least one camera. The second monitoring system is communicatively coupled to the control system and is configured to compare the fabricated component to the computerized model.

A method for managing electronic components includes a manufacturer-side process including preparing bulk cases provided with RFID tags storing unique IDs and including electronic components stored therein, storing manufacturer-side information in association with the unique IDs in a manufacturer-side-information storage area on a cloud, and shipping the electronic components on a per-bulk case basis, receiving the shipped bulk cases, reading the unique IDs stored in the RFID tags, and obtaining, based on the read unique IDs, the manufacturer-side information stored in the manufacturer-side-information storage area in the cloud.