A semiconductor process management system is provided. The semiconductor process management system includes a communicator that receives a process recipe from one or more process apparatuses and receives a measured value for each sampling point from one or more measuring apparatus, and a first determination unit that establishes a mutual influence model between the process recipe and the measured value for each sampling point based on the process recipe and the measured value for each sampling point.

There is provided a configuration that includes: a main controller configured to, when executing a process recipe including a specific step of executing a sub-recipe, control a process controller to execute the sub-recipe a predetermined number of times to perform a predetermined process to a substrate: and a device management controller configured to collect device data during an execution of the process, recipe and store the device data in a storage part. The device management controller is further configured to: search the storage part; acquire the device data in a designated step among respective steps constituting the sub-recipe for a number of times of execution of the sub-recipe; calculate a first standard deviation of the device data acquired for the number of times of execution; and compare the first standard deviation with a threshold value and generate an alarm when the first standard deviation exceeds the threshold value.

An electronic device manufacturing system capable of obtaining metrology data associated with a deposition process performed on a substrate according to a process recipe, wherein the deposition process generates a plurality of layers on a surface of the substrate. The manufacturing system can further obtain an expected profile associate with the process recipe, wherein the expected profile comprises a plurality of values indicative of a desired thickness for a plurality of layers of the process recipe. The manufacturing system can further generate a correction profile based on the metrology data and the expected profile, wherein the correction profile comprises a deposition time offset value for at least one layer of the plurality of layers. The manufacturing system can further generate an updated process recipe by applying the correction profile to the process recipe and cause a deposition step to be performed on the substrate according to the updated process recipe.

Disclosed is a wireless monitoring device for flexible material processing, including a numerical control cutting device, a PC control device, and a smart terminal; the numerical control cutting device includes an equipment controller, a servo system and a cutting module, the equipment controller is communicatively connected with the PC control device, and the equipment controller controls the servo system and the cutting module; the PC control device is communicatively connected with the smart terminal, and the smart terminal includes a control module and a monitoring module. The object of the disclosure is to allow an operator to use the smart terminal to realize mobile monitoring of cutting processing of flexible material, which is more convenient for the operator to operate the cutting machine.

There is provided a configuration that includes: a main controller configured to, when executing a process recipe including a specific step of executing a sub-recipe, control a process controller to execute the sub-recipe a predetermined number of times to perform a predetermined process to a substrate: and a device management controller configured to collect device data during an execution of the process, recipe and store the device data in a storage part. The device management controller is further configured to: search the storage part; acquire the device data in a designated step among respective steps constituting the sub-recipe for a number of times of execution of the sub-recipe; calculate a first standard deviation of the device data acquired for the number of times of execution; and compare he first standard deviation with a threshold value and generate an alarm when the first standard deviation exceeds the threshold value.

A mesh network portal provides a graphical user interface (GUI) for invocation and management of a plurality of robotic workcells, such that each workcell includes a robot and associated peripherals for performing a job. The job fulfills a robotic task such as generating a part or other sequence of robotic instructions for a discrete, quantifiable work product. The portal is in network communication with a respective hub at a plurality of workcells, and maintains a set of recipes corresponding to the jobs selectable for each of the plurality of robots in the workcells. The GUI allows selection of a workcell, identifies the recipes available for the workcell based on the robot and peripherals in the workcell. Selection of the recipe commences execution of the recipe by the workcell. including robotic guidance elements for fulfilling a robotic task.

The present invention improves the accuracy of detecting abnormality in a substrate processing apparatus. A failure detection apparatus 520 is provided with a data acquisition part 522 used to collect data detected by sensors 270-1 to 270-a, 370-1 to 370-b and 470-1 to 470-c disposed in a CMP apparatus. In addition, the failure detection apparatus 520 is provided with a determination part 524 used to read recipe data from a recipe storage part 512, to compare the recipe data thus read with the data collected by a data acquisition part 522, thereby determining that abnormality is present in the CMP apparatus if the two data items differ.

A computerized system that may include a recipe module and a yield diagnostics module. The yield diagnostics module may be configured to generate evaluation results that are indicative of an outcome of an evaluation process of at least one manufacturing stage of at least one electrical circuit. The evaluation results differ from end of line (EOL) results. The recipe module may be configured to receive EOL results relating to the at least one electrical circuit, to receive the evaluation results relating to the at least one electrical circuit; to correlate the evaluation results and the EOL results to provide correlation results; and respond to the correlation results. The responding to the correlation results may include determining whether to alter a recipe in response to the correlation results and altering the recipe if it is determined to alter the recipe.

There is provided a group management system including one or more manufacturing devices and one or more server devices. Each of the manufacturing devices includes a manufacturing device display unit configured to display information on the specified process, an acquiring unit configured to acquire information of respective parts of each of the manufacturing devices and an acquired information transmitting unit configured to transmit the acquired information to the server devices. Each of the server devices includes a storage unit configured to store the information transmitted from the acquired information transmitting unit, an analysis unit configured to analyze the stored information and a server device display unit configured to display the stored information and the analyzed information. Each of the manufacturing devices further includes a remote operation function unit configured to directly operate the server device display unit from the manufacturing device display unit.

An electronic device manufacturing system capable of obtaining metrology data associated with a deposition process performed on a substrate according to a process recipe, wherein the deposition process generates a plurality of layers on a surface of the substrate. The manufacturing system can further obtain an expected profile associate with the process recipe, wherein the expected profile comprises a plurality of values indicative of a desired thickness for a plurality of layers of the process recipe. The manufacturing system can further generate a correction profile based on the metrology data and the expected profile, wherein the correction profile comprises a deposition time offset value for at least one layer of the plurality of layers. The manufacturing system can further generate an updated process recipe by applying the correction profile to the process recipe and cause a deposition step to be performed on the substrate according to the updated process recipe.