Implementations described herein generally relate to improving silicon wafer manufacturing. In one implementation, a method includes receiving information describing a defect. The method further includes identifying a critical area of a silicon wafer and determining the probability of the defect occurring in the critical area. The method further includes determining, based on the probability, the likelihood of an open or a short occurring as a result of the defect occurring in the critical area. The method further includes providing, based on the likelihood, predictive information to a manufacturing system. In some embodiments, corrective action may be taken based on the predictive information in order to improve silicon wafer manufacturing.

An inspection information prediction apparatus includes an environment-information acquisition unit that acquires environment information of a routing step through which an inspection target has been routed before an inspection step of inspecting the inspection target, a manufacturing-information acquisition unit that acquires manufacturing information of the inspection target, and a prediction unit that predicts inspection information which indicates an inspection result of an inspection portion of the inspection target determined by the manufacturing information and is obtained by applying the environment information, based on the manufacturing information of the inspection target and the environment information of the routing step through which the inspection target has been routed.

An inspection information prediction apparatus includes an environment-information acquisition unit that acquires environment information of a routing step through which an inspection target has been routed before an inspection step of inspecting the inspection target, a manufacturing-information acquisition unit that acquires manufacturing information of the inspection target, and a prediction unit that predicts inspection information which indicates an inspection result of an inspection portion of the inspection target determined by the manufacturing information and is obtained by applying the environment information, based on the manufacturing information of the inspection target and the environment information of the routing step through which the inspection target has been routed.

A product quality prediction method for mass customization is provided. When a production system has a status change, data of sets of process parameters and actual measurement values of workpiece samples processed before the status change occurs, and data of sets of process parameters and actual measurement values of few workpiece samples processed after the status change occurs are used for build or retrain a prediction model, thereby predicting a metrology value of a next workpiece.

Implementations described herein generally relate to improving silicon wafer manufacturing. In one implementation, a method includes receiving information describing a defect. The method further includes identifying a critical area of a silicon wafer and determining the probability of the defect occurring in the critical area. The method further includes determining, based on the probability, the likelihood of an open or a short occurring as a result of the defect occurring in the critical area. The method further includes providing, based on the likelihood, predictive information to a manufacturing system. In some embodiments, corrective action may be taken based on the predictive information in order to improve silicon wafer manufacturing.

A product quality prediction method for mass customization is provided. When a production system has a status change, data of sets of process parameters and actual measurement values of workpiece samples processed before the status change occurs, and data of sets of process parameters and actual measurement values of few workpiece samples processed after the status change occurs are used for build or retrain a prediction model, thereby predicting a metrology value of a next workpiece.