Patent classifications
G05B2219/32188
DATA PROCESSING METHOD, DEVICE AND SYSTEM, AND ELECTRONIC DEVICE
A data processing method includes: obtaining a defect type of a sample set in response to a first input of a user on a first interface, the sample set including samples, each sample having a first parameter used to represent a defect degree of the sample with regard to the defect type and a second parameter used to represent device informations of sample production devices through which the sample passes; calculating yield purity indexes of sample production devices on the samples based on first parameters and second parameters of the samples, so as to obtain influencing parameters of the sample production devices, an influencing parameter of each sample production device being used to represent an influence degree to which the sample production device affects an occurrence of the defect type on the samples; and displaying the influencing parameters of the sample production devices on a second interface.
DISPLACEMENT MEASUREMENTS IN SEMICONDUCTOR WAFER PROCESSING
Wafers that begin as flat surfaces during a semiconductor manufacturing process may become warped or bowed as layers and features are added to an underlying substrate. This warpage may be detected between manufacturing processes by rotating the wafer adjacent to a displacement sensor. The displacement sensor may generate displacement data relative to a baseline measurement to identify areas of the wafer that bow up or down. The displacement data may then be mapped to locations on the wafer relative to an alignment feature. This mapping may then be used to adjust parameters in subsequent semiconductor processes, including adjusting how a carrier head on a polishing process holds or applies pressure to the wafer as it is polished. A model may be trained to provide control signals for a polishing/cleaning process, or to generate metrology data.
VALUE-INDEPENDENT SITUATION IDENTIFICATION AND MATCHING
A method includes receiving one or more fingerprint dimensions to be used to generate a fingerprint. The method further includes receiving trace data associated with a manufacturing process. The method further includes applying the one or more fingerprint dimensions to the trace data to generate at least one feature. The method further includes generating the fingerprint based on the at least one feature. The method further includes causing, based on the fingerprint, performance of a corrective action associated with one or more manufacturing processes.
METHODS AND SYSTEMS FOR WORKPIECE QUALITY CONTROL
A computer-implemented method for providing a trained function for performing a workpiece quality control includes receiving a plurality of training machining datasets, wherein different training high-frequency machining datasets are representative for the quality of different workpieces, transforming the plurality of training machining datasets into the time-frequency domain to generate a plurality of training time-frequency domain datasets, and training a function based on the plurality of training time-frequency domain datasets, wherein the function is based on an autoencoder. The autoencoder has input layers, output layers and a hidden layer. The plurality of training time-frequency domain datasets are provided to the input layers and the output layers during training, and a trained autoencoder function is outputted.
MANUFACTURING EQUIPMENT CONTROL VIA PREDICTIVE SEQUENCE TO SEQUENCE MODELS
One or more processors generate a feature set describing evolution of a state space of a manufacturing system from time series data of sensors measuring values of control parameters and exogenous parameters of the manufacturing system, and measuring values of feature parameters of components produced by the manufacturing system. The one or more processors also generate from the feature set predicted values of at least one of the feature parameters, and alter at least one of the control parameters according to the feature set and the predicted values to drive the predicted values toward a target value or target values.
Product state estimation device
A product state estimation device includes: an examination result acquisition device that acquires an examination result related to a state of a product obtained through each shot by a die-casting machine; a time series data acquisition device that acquires time series data based on an output from a sensor that detects an operation state of the die-casting machine at each shot; a time series data manipulation device that performs manipulation that clips data of a predetermined time interval out of the time series data; an estimation model generation device that generates an estimation model by using a neural network with the examination result of the product and the manipulated time series data as learning data; and an estimation device that estimates information related to quality of the product based on the manipulated time series data obtained from a plurality of detection signals at each shot by using the estimation model.
Material processing optimization
Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing material processing. In one aspect, a method includes collecting, from a set of sensors, a set of current manufacturing conditions. Based on the set of current manufacturing conditions collected from the sensors, a set of current qualities of a material currently being processed by manufacturing equipment is determined. A baseline production measure for processing the material according to the set of current qualities is obtained. A candidate set of manufacturing conditions that provide an improved production measure relative to the baseline production measure is determined. A set of candidate qualities for the material produced under the candidate set of manufacturing conditions is determined. A visualization that presents both of the set of candidate qualities of the material and the set of current qualities of the material currently being processed is generated.
COATING PRODUCTION LINE SYSTEM
A coating production line system for coating work pieces comprises a coating powder, a coating apparatus, an inspection unit to measure the thickness of the applied coating, a conveyor unit to move the work pieces through the system, and a control unit to use thickness requirements and coating parameters to control the coating apparatus based on said coating parameters with a machine learning instance. A database comprises coating powder characteristics parameter as input vector for the machine learning instance for generating an output vector to control the coating apparatus being a first additional part vector. The control unit determines the coating quality based on a comparison between the thickness data acquired from the inspection unit and the retrieved thickness requirement data as second additional part vector. The first and second additional part vectors are fed back as additional parts to the next input vector for the machine learning instance.
DEFECT IDENTIFICATION USING MACHINE LEARNING IN AN ADDITIVE MANUFACTURING SYSTEM
An additive manufacturing system comprises an apparatus arranged to distribute layer of metallic powder across a build plane and a power source arranged to emit a beam of energy at the build plane and fuse the metallic powder into a portion of a part. The system includes a processor configured to steer the beam of energy across the build plane and receive data generated by one or more sensors that detect electromagnetic energy emitted from the build plane when the beam of energy fuses the metallic powder. The received data is converted into one or more parameters that indicate one or more conditions at the build plane while the beam of energy fuses the metallic powder. The one or more parameters are used as input into a machine learning algorithm to detect one or more defects in the fused metallic powder.
CYBER-PHYSICAL SYSTEM TYPE MACHINING SYSTEM
A cyber-physical system type machining system includes: a machine tool disposed in a real world and including a machine body and a control device; and a computer device connected to communicate with the control device and including a processor and a memory storing a program for generating, in a virtual world, a virtual machining phenomenon corresponding to an actual machining phenomenon with regard to a workpiece and the machine body. The program, when executed by the processor, causes the computer device to perform: acquiring a command value in synchronization with the control device, the command value for controlling the machine body by the control device; generating a future virtual machining phenomenon, which is the virtual machining phenomenon in a future, based on the command value; and outputting, to the control device, an optimal command value for correcting the command value based on the future virtual machining phenomenon.