A method for manufacturing a plurality of components, each of the plurality of components including at least one electrical feedthrough, in which a functional element is fastened in a feedthrough opening in a base body by way of an electrically insulating material, an information being acquired in association with each of the plurality of components, the method comprising the steps of: providing, in one of a plurality of manufacturing steps of the method, each of the plurality of components or one of a plurality of pre-stages of each of the plurality of components with an information store, at least one of (i) the information being stored in the information store, and (ii) an identifier is stored in the information store and the information is stored in a database in association with the identifier.

Various embodiments enable batch inspection of a plurality of workpieces by and inspection instrument such as a coordinate measuring machine. Some embodiments present user interfaces, including graphical user interfaces, to enable an operator to configure a batch inspection system and a batch inspection job, and to monitor and control execution of a batch inspection job.

Various embodiments enable batch inspection of a plurality of workpieces by and inspection instrument such as a coordinate measuring machine. Some embodiments present user interfaces, including graphical user interfaces, to enable an operator to configure a batch inspection system and a batch inspection job, and to monitor and control execution of a batch inspection job.

Various embodiments enable batch inspection of a plurality of workpieces by and inspection instrument such as a coordinate measuring machine. Some embodiments present user interfaces, including graphical user interfaces, to enable an operator to configure a batch inspection system and a batch inspection job, and to monitor and control execution of a batch inspection job.

Various embodiments enable batch inspection of a plurality of workpieces by and inspection instrument such as a coordinate measuring machine. Some embodiments present user interfaces, including graphical user interfaces, to enable an operator to configure a batch inspection system and a batch inspection job, and to monitor and control execution of a batch inspection job.

A lithographic process is performed on a plurality of semiconductor substrates. The method includes selecting one or more of the substrates as one or more sample substrates. Metrology steps are performed only on the selected one or more sample substrates. Based on metrology results of the selected one or more sample substrates, corrections are defined for use in controlling processing of the substrates or of future substrates. The selection of the one or more sample substrates is based at least partly on statistical analysis of object data measured in relation to the substrates. The same object data or other data can be used for grouping substrates into groups. Selecting of one or more sample substrates can include selecting substrates that are identified by the statistical analysis as most representative of the substrates in their group and/or include elimination of one or more substrates that are identified as unrepresentative.

A method for measuring components produced by a production device includes selecting components to be measured from multiple components. The selection is made according to at least one selection parameter. The at least one selection parameter includes a sampling frequency. The method includes determining at least one production parameter. The at least one production parameter includes a production condition. The method includes adapting the sampling frequency based on the production parameter or a change in the production parameter. Adapting includes reducing the sampling frequency in response to one or more production parameters not changing by more than a predetermined amount.

A dynamic sampling method and device for semiconductor manufacture are provided. The dynamic sampling method includes: generating an N-dimensional virtual image of a wafer based on a design rule and at least one of a quality control data and context data; measuring a critical pattern in the N-dimensional virtual image to generate a virtual metrology result by using a virtual metrology; determining whether the virtual metrology result is larger than a threshold; not performing a measurement on the wafer in a case that the virtual metrology result is larger than the threshold; and performing the measurement on the wafer in a case that the virtual metrology result is not larger than the threshold.

A method for analyzing test results. The method includes selecting a first subset of tests from a plurality of tests. Test results are gathered from the plurality of tests in real-time. A first statistical analysis is performed on test results from the first subset of tests. At least one process control rule is initiated as determined by results of the first statistical analysis performed on the test results from the first subset of tests.

A dynamic sampling method and device for semiconductor manufacture are provided. The dynamic sampling method includes: generating an N-dimensional virtual image of a wafer based on a design rule and at least one of a quality control data and context data; measuring a critical pattern in the N-dimensional virtual image to generate a virtual metrology result by using a virtual metrology; determining whether the virtual metrology result is larger than a threshold; not performing a measurement on the wafer in a case that the virtual metrology result is larger than the threshold; and performing the measurement on the wafer in a case that the virtual metrology result is not larger than the threshold.