Patent classifications
G05B2219/32313
Managing method and managing device of an electronic component mounting system having a plurality of production lines
A managing method of an electronic component mounting system having a plurality of production lines, the method including: preferentially allocating a job group having the latest scheduled finish time among a plurality of job groups, to one of the plurality of production lines. The allocating includes (1) specifying the scheduled finish time with respect to all of the combinations between unallocated job groups among the plurality of job groups and the plurality of production lines, (2) specifying the earliest scheduled finish time from the scheduled finish time specified for each production line, and the production line thereof, with respect to each of the unallocated job groups, and (3) allocating the job group related to the latest scheduled finish time among the earliest scheduled finish time specified for each unallocated job group, to the production line thereof.
Dispatching method and system
A method of dispatching wafer lots through a plurality of process chambers, wherein the process chambers are disposed in at least one machine. The method includes: receiving wafer lot information and process chamber data, wherein the wafer lot information identifies the wafer lots to be processed at the machine, and the process chamber data includes process information associated with the process chambers; determining a load factor of each process chamber based on the wafer lot information and process chamber data; receiving historical data of run lots previously processed through the process chambers, and determining a processing time of the wafer lots based on the historical data; generating a dispatching criteria for the wafer lots based on the load factors of the process chambers and the determined processing time of the wafer lots; and dispatching the wafer lots through the process chambers based on the dispatching criteria.