An apparatus for automated mold polishing is disclosed. In an embodiment, the apparatus comprises at least a processor and a memory communicatively connected to the processor. The memory containing instructions configuring the at least a processor to receive a finish assignment for at least a surface of a part for manufacture. The processor then determines a polish strategy for the at least a surface as a function of a geometry of the at least a surface. A polishing tool may then be selected for the at least a surface as a function of the finish assignment and the polish strategy for the at least a surface. A reachable area is then determined of the at least a surface as a function of the polishing tool. The processor then generates a toolpath as a function of the reachable area.

An apparatus for automated mold polishing is disclosed. In an embodiment, the apparatus comprises at least a processor and a memory communicatively connected to the processor. The memory containing instructions configuring the at least a processor to receive a finish assignment for at least a surface of a part for manufacture. The processor then determines a polish strategy for the at least a surface as a function of a geometry of the at least a surface. A polishing tool may then be selected for the at least a surface as a function of the finish assignment and the polish strategy for the at least a surface. A reachable area is then determined of the at least a surface as a function of the polishing tool. The processor then generates a toolpath as a function of the reachable area.

A robotic system is presented that includes a surface inspection system that receives sampling information for a number of areas within a region of a worksurface. The system also includes a robotic arm, coupled to a surface engaging tool, the robotic repair arm being configured to cause the surface processing tool to engage the region of the worksurface. The system also includes a process mapping system configured to, based on the sampling information: approximate a surface topography in the region of the worksurface, generate a surface processing plan for the region based on the approximated surface topography that includes a trajectory. The surface processing plan includes one of: a force profile along the trajectory, a velocity profile for the surface engaging tool along the trajectory, a rotational speed profile, for the surface engaging tool, along the trajectory, or a trajectory modification that accounts for the presence of a surface feature identified in the approximated surface topography. The process mapping system is also configured to generate a control signal for the robotic arm that includes the surface processing plan.