Provided is a machine system having optical endpoint control and associated method for maintaining having is provided constant optical contact. Specifically, the machine system comprises a machine capable of movement in at least one direction. The machine is configured such that, during a calibration phase, a steerable retroreflective system is mounted upon the machine for movement therewith. A controller is configured to control the movement of the machine in at least one direction. The machine system may be configured to automatically adjust the feedrate of the machine, upon determining that a velocity required for the positioner to move the retroreflector to a desired position exceeds a certain segment feedrate threshold, such that an incident beam of light can maintain constant contact with the retroreflector throughout movement of the machine from the first position to the second position.

Wafers that begin as flat surfaces during a semiconductor manufacturing process may become warped or bowed as layers and features are added to an underlying substrate. This warpage may be detected between manufacturing processes by rotating the wafer adjacent to a displacement sensor. The displacement sensor may generate displacement data relative to a baseline measurement to identify areas of the wafer that bow up or down. The displacement data may then be mapped to locations on the wafer relative to an alignment feature. This mapping may then be used to adjust parameters in subsequent semiconductor processes, including adjusting how a carrier head on a polishing process holds or applies pressure to the wafer as it is polished. A model may be trained to provide control signals for a polishing/cleaning process, or to generate metrology data.

A processing apparatus includes an articulated robot having an arm distal-end portion to which a processing tool configured with a cutting edge portion and a profiling portion and a shape measurement unit are attached, and a processor. The processor, in a workpiece set state, recognizes, by measuring a shape of the workpiece using the shape measurement unit, a tilt of a profiled surface portion of the workpiece and a position of a process portion of the workpiece to generate processing-target-portion information based on the position of the process portion, generates processing-point information indicating a processing point, moves the arm distal-end portion to the processing point based on the processing-point information, controls an orientation of the processing tool in accordance with the tilt of the profiled surface portion of the workpiece to perform the specified processing on the workpiece using the processing tool.

The installation position pointer system comprises a laser source to supply a laser beam, a driving device to align the laser beam, a controller device to control the operation of the driving device in accordance with an installation position data (IPD) of an attachment to be installed in a building and an associated reference position in the building, and an input device to obtain the IPD of a plurality of attachments from the attachment. The IPD of the attachments may be provided by an attachment installation position database system.

A system for performing interactions within a physical environment including: a robot base that undergoes movement relative to the environment; a robot arm mounted to the robot base, the robot arm including an end effector mounted thereon; a first tracking system that measures a robot base position; a second tracking system that measures movement of the robot base; and, a control system that uses a robot base position to at least partially control the robot arm to move the end effector along an end effector path, wherein the control system: determines the robot base position at least in part using signals from the first tracking system; and, in the event of failure of the first tracking system: determines a robot base position using signals from the second tracking system; and, controls the robot arm to move the end effector along the end effector path at a reduced end effector speed.

A processing apparatus 1 includes: a workpiece-set-position recognition unit 114 that moves an arm distal-end portion to a specified position measurement point to measure a shape of a workpiece in a workpiece set state in which the workpiece is positioned by a workpiece positioning unit, and thereby recognizes a set position of the workpiece; a processing-point-information generation unit 115 that, based on the set position of the workpiece and processing-target-portion information 124 indicating a position of a target portion of the workpiece for specified processing, generates processing-point information 125 indicating a processing point which is a movement point of the arm distal-end portion to perform the specified processing on the workpiece using a processing tool in the workpiece set state; and a workpiece-processing control unit 116 that moves the arm distal-end portion to the processing point based on the processing-point information 125 to perform the specified processing on the workpiece using the processing tool.

A spatial accuracy correction apparatus performs a spatial accuracy correction of a positioner displacing a displacer to a predetermined set of spatial coordinates using a measurable length value measured by an interferometer and a measurable value of the set of spatial coordinates of the displacement body that is measured by the positioner. The measured length value and the measured value for each measurement point are acquired by displacing the displacement body to a plurality of measurement points in order, one or more repeated measurements are conducted for at least one of the plurality of measurement points being measured after conducting measurement of the measured length value and the measured value for each of the plurality of measurement points, and the plurality of points are measured again when a repeat error of the measured length value is equal to or greater than a threshold value.

A sensing apparatus monitors a cover optic on a laser processing head for contamination, indicating the need to replace the cover optic. The apparatus includes at least one reflector and at least one sensors that are disposed in the processing head adjacent a periphery of the cover optic. The reflector reflects radiation from the laser beam deflected from contamination on the cover optic and incident thereagainst. The sensor is offset from the reflector and detects at least a portion of the radiation reflected by the reflector. A controller in communication with the sensor can determine the contamination on the cover optic based on the detected radiation.

A processing apparatus 1 includes: a workpiece-set-position recognition unit 114 that moves an arm distal-end portion to a specified position measurement point to measure a shape of a workpiece in a workpiece set state in which the workpiece is positioned by a workpiece positioning unit, and thereby recognizes a set position of the workpiece; a processing-point-information generation unit 115 that, based on the set position of the workpiece and processing-target-portion information 124 indicating a position of a target portion of the workpiece for specified processing, generates processing-point information 125 indicating a processing point which is a movement point of the arm distal-end portion to perform the specified processing on the workpiece using a processing tool in the workpiece set state; and a workpiece-processing control unit 116 that moves the arm distal-end portion to the processing point based on the processing-point information 125 to perform the specified processing on the workpiece using the processing tool.

The invention relates to a method for measuring a tool (1) for roll machining toothed workpieces, wherein a virtual contact points is calculator on a rounded virtual blade of a virtual tool. The relative orientation between the tool axis (B) and the measuring device (11) as well as a translational relative position between the tool and the measuring device are then calculated and adjusted on the basis of the calculated virtual contact point. The measurement is taken on the real blade in the adjusted relative orientation and relative position, and the measurement can be taken in particular using a cylindrical scanning means in the form of a laser beam, wherein the cylindrical scanning means tangentially contacts the virtual blade in the virtual contact point.