Methods and systems for measuring a component of a drug delivery or storage device are described. The method comprises providing a light source in an opposing relationship with an optical imaging sensor; positioning a sample component on a positioning stage located between the at least one light source and at least one opposing optical imaging sensor; and illuminating, with the at least one light source, the sample component. The controller is operable to capture an image of the component, determine the location of a first outer edge point PI of the captured image; rotate the sample component relative to the optical image sensor, and collect n images separated from each other by x degrees of rotation, wherein n*x is ≥360 degrees. The controller may compare a measured position of the at least one outer edge point PI between the captured images to determine a degree or circular runout.

Methods and systems for measuring a component of a drug delivery or storage device are described. The method comprises providing a light source in an opposing relationship with an optical imaging sensor; positioning a sample component on a positioning stage located between the at least one light source and at least one opposing optical imaging sensor; and illuminating, with the at least one light source, the sample component. The controller is operable to capture an image of the component, determine the location of a first outer edge point PI of the captured image; rotate the sample component relative to the optical image sensor, and collect n images separated from each other by x degrees of rotation, wherein n*x is ≥360 degrees. The controller may compare a measured position of the at least one outer edge point PI between the captured images to determine a degree or circular runout.

A method and apparatus for treating a circumferential edge of a part are described. The method includes the steps of (1) mapping the circumferential edge of the part with a measuring device, either directly or differentially from a known shape profile; and (2) using the measured data to more accurately follow the circumferential edge of the part during subsequent treatment processing steps, thereby improving the accuracy of the treatment process and compared with a non-mapped treatment process.

A method and apparatus for treating a circumferential edge of a part are described. The method includes the steps of (1) mapping the circumferential edge of the part with a measuring device, either directly or differentially from a known shape profile; and (2) using the measured data to more accurately follow the circumferential edge of the part during subsequent treatment processing steps, thereby improving the accuracy of the treatment process and compared with a non-mapped treatment process.