A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a plurality of treating chambers performing a respective treatment on a substrate therein; a transfer chamber having a robot transferring the substrate between the plurality of treating chambers; a detection unit mounted on the robot and configured to detect a substrate state; and a controller for controlling the detection unit, wherein the detection unit comprises: an imaging member for imaging the substrate; and a driving member for moving the imaging member, and wherein the controller controls the detection unit to image and store an image of the substrate at an optimal position and determines whether an image of the substrate is a normal state based on the image obtained in the optimal position, the optimal position determined based on a process variable of the treating chamber.

Embodiments relate to a device for correcting a robotic arm, including: a first robotic arm positioned in a vacuum transmission chamber; a first jig wafer comprising a first wafer body and a first jig positioned on a front surface of the first wafer body; a first distance measuring sensor positioned at a center position of a back surface of the first wafer body and configured to detect whether a center of the first jig wafer is aligned with a center of a wafer chuck; a second distance measuring sensor positioned on the front surface of the first wafer body and on an outside of the first jig and configured to detect a lifting height of the first robotic arm when the first robotic arm controls a pick-and-place operation the first jig wafer on an upper surface of the wafer chuck.

Embodiments described herein generally relate to an apparatus and method of performing a robot calibration process within a substrate processing system. In one embodiment, a calibration device is used to calibrate a robot having an end effector. The calibration device includes a body, a first side and a second side opposite to the first side. The calibration device further includes a sensor disposed on the second side of the body. In some embodiments, the sensor covers the entire second side of the body. In this configuration, because the sensor covers the entire second side of the body of the calibration device, the calibration device can be utilized to sense the contact between the sensor and various differently configured chamber components found in different types of processing chambers or stations disposed within a processing system during a calibration process performed in each of the different processing chambers or stations.

The present disclosure relates to a method in materials testing to automatically locate the center of a feature on or in an object using the off-axis force feedback of a loadcell. In this disclosure, either a simplified model of the product or device being tested, or the product itself, is placed under the loadcell probe with the feature of interest roughly aligned under the probe tip. The probe is driven down into the feature. The product is automatically positioned relative to the probe in the x-direction until the side of the probe contacts the side of the feature. Contact is determined by monitoring the force feedback from the loadcell. When the vertical force from the side-load surpasses a pre-determined setpoint, contact is assumed and the value of the x-position of the product with respect to the probe is recorded. The product is then repositioned in the opposite direction in the x-axis to record the touch load on the other side. The center is then calculated as the average of the x values. The process is repeated along the y-axis. This data is then used to calculate the center of the feature and the product can be positioned at this location so that the probe is centered over the center thereof.

A drilling method is provided allowing drilling in confined spaces with less effort. Two independent data sources are used for reducing tolerances between the component to be joined to the workpiece. The component is measured at the supplier using photogrammetry or laser scanning First geometric data of the component obtained by this measurement are put in a data storage, such as a barcode tag or database. At the manufacturer, the first geometric data are used to position the component relative to the workpiece. Subsequently, the component is measured to obtain second geometric data indicative of the positions and diameters of the component joining holes. After determining a deviation between the first and second geometric data to be smaller than a predetermined threshold, the automatic drill is positioned at the correct drilling location and joining holes are drilled into the workpiece. Finally, the component and the workpiece are joined by fasteners.

A die layout calculation method is provided. The method includes: selecting, based on a distribution array of a plurality of dies in a wafer, one die as a reference die; making first movements of a wafer center to determine a first coverage region for each first movement, and determining a feasible region based on a number of complete dies in each first coverage region; making a plurality of second movements of the wafer center in the feasible region to determine a second coverage region for each second movement, and determining a relative position of the wafer center in the reference die corresponding to a maximum number of complete dies in the second coverage region; and determining a die layout comprising a location of each die in the wafer. This method improves the accuracy and efficiency of determining the maximum number of dies.

A target provided to a substrate placement portion is detected by an object detection sensor at a plurality of rotation positions of the substrate placement portion. An index length which is a distance from a robot reference axis to the target in a direction perpendicular to an axial direction, or information correlated therewith, is calculated. At least one of a rotation position of a detection line about the robot reference axis and a rotation position of the substrate placement portion about a rotation axis when the target located on a line connecting the robot reference axis and the rotation axis is detected is calculated on the basis of the calculated index length or the calculated information correlated therewith. A direction in which the rotation axis is present as seen from the robot reference axis is specified on the basis of the calculated rotation position.

A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

A device for automatically detecting a through-hole rate of a honeycomb sandwich composite-based acoustic liner, including a customized tooling, a data acquisition system, a motion mechanism and a data processing system. The data acquisition system is configured to acquire a surface three-dimensional (3D) point cloud data of an acoustic liner using a two-dimensional (2D) laser profile sensor in a manner of parallel movement shooting, and connected with a graphics workstation. The motion mechanism includes an industrial robot, and the 2D laser profile sensor is fixed at an end of the industrial robot. The motion mechanism is configured to support the data acquisition system to perform translational scanning. The data processing system includes the graphics workstation, and plays a role of path planning and data storage. A method for automatically detecting a through-hole rate of a honeycomb sandwich composite-based acoustic liner is also provided.