A method of measuring quality in a machining operation of a device includes measuring lost motion for at least one axis of the device during the machining operation, calculating a spindle lag of a spindle of the device during the machining operation, determining a lost motion deviation, determining a spindle lag deviation, and identifying a machining defect based on the lost motion deviation coinciding with the spindle lag deviation.

A method of measuring quality in a machining operation of a device includes measuring lost motion for at least one axis of the device during the machining operation, calculating a spindle lag of a spindle of the device during the machining operation, determining a lost motion deviation, determining a spindle lag deviation, and identifying a machining defect based on the lost motion deviation coinciding with the spindle lag deviation.