A method and apparatus for treating a circumferential edge of a part are described. The method includes the steps of (1) mapping the circumferential edge of the part with a measuring device, either directly or differentially from a known shape profile; and (2) using the measured data to more accurately follow the circumferential edge of the part during subsequent treatment processing steps, thereby improving the accuracy of the treatment process and compared with a non-mapped treatment process.

A method and apparatus for treating a circumferential edge of a part are described. The method includes the steps of (1) mapping the circumferential edge of the part with a measuring device, either directly or differentially from a known shape profile; and (2) using the measured data to more accurately follow the circumferential edge of the part during subsequent treatment processing steps, thereby improving the accuracy of the treatment process and compared with a non-mapped treatment process.