A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

A method and system for using image analysis to generate an automobile surface protecting device attached with an adhesive are provided. The method includes generating from a scanned three-dimensional image, using one or more image analysis applications, a protective film template for a vehicle panel based on the dimensions of the vehicle panel, a determined transition point, a determined termination point, and a plurality of relief cuts. Generating the protective film template includes converting a three-dimensional protective film template into a two-dimensional protective film template by flattening the protective film template. The method includes transferring the protective film template to the sheet of protective film. The sheet of protective film includes an adhesive and is used to modify an appearance of the vehicle panel by modifying how light reflects off scratches on the vehicle panel.

A method and system for using image analysis to generate an automobile surface protecting device attached with an adhesive are provided. The method includes generating from a scanned three-dimensional image, using one or more image analysis applications, a protective film template for a vehicle panel based on the dimensions of the vehicle panel, a determined transition point, a determined termination point, and a plurality of relief cuts. Generating the protective film template includes converting a three-dimensional protective film template into a two-dimensional protective film template by flattening the protective film template. The method includes transferring the protective film template to the sheet of protective film. The sheet of protective film includes an adhesive and is used to modify an appearance of the vehicle panel by modifying how light reflects off scratches on the vehicle panel.

Methods and apparatuses for controlling a projector are provided. In some embodiments, a method includes: controlling the light source to emit point structured light to a reflector; and adjusting a tilt angle of the reflector to change the tilt angle of the reflector, and to enable the point structured light reflected from the reflector to an optical conversion device to deflect towards a preset scanning direction. The optical conversion device is used for converting the point structured light incident onto the optical conversion device into line structured light. The line structured light is used for forming a pattern that is projected onto a surface of a target object and extends along a direction intersecting with the preset scanning direction. Improved efficiency in three-dimensional scanning of a target object can be achieved.

Methods and apparatuses for controlling a projector are provided. In some embodiments, a method includes: controlling the light source to emit point structured light to a reflector; and adjusting a tilt angle of the reflector to change the tilt angle of the reflector, and to enable the point structured light reflected from the reflector to an optical conversion device to deflect towards a preset scanning direction. The optical conversion device is used for converting the point structured light incident onto the optical conversion device into line structured light. The line structured light is used for forming a pattern that is projected onto a surface of a target object and extends along a direction intersecting with the preset scanning direction. Improved efficiency in three-dimensional scanning of a target object can be achieved.

A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.