Embodiments of the present disclosure provide a control method and apparatus for hybrid process recipes, and a device and a medium. The control method includes: acquiring hybrid process recipe operation groups associated with process recipes operated by etching chambers of an etching machine, where different process recipes correspond to different hybrid process recipe operation groups; acquiring a switching rule of different hybrid process recipe operation groups; and controlling, based on a reserved process recipe for a real-time reserved demand of a target etching chamber and a requirement of the switching rule, the etching machine to automatically switch to a target hybrid process recipe operation group associated with the reserved process recipe.

Systems, methods, and apparatus for marking a metallic workpiece for tracking and tracing the metallic workpiece throughout its production and consumer lifecycle are disclosed. The mark may be formed on a sheet of a metallic material. In some embodiments, a bodymaker forms a cup from a blank cut from the sheet into the metallic workpiece with the mark positioned on a closed end of the metallic workpiece. The mark is scanned for tracking and tracing at various points during the production of the metallic workpiece and during the lifecycle of the metallic workpiece, such as at a point of filling, point of sale and a collection point where the metallic workpiece is recycled or destroyed. Information collected as the mark is scanned provides valuable information that can be used to improve the manufacturing process, strategic production and distribution, incentivize recycling of the metallic workpiece, and to improve deposit return programs.

Disclosed is a dicing system including a protection layer forming apparatus, a patterning apparatus, a plasma treatment apparatus, a measuring apparatus that obtains at least of first processing data relating to a protection layer, second processing data relating to a mask, and third processing data relating to element chips, and a control unit that operates at least one of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus on a recipe that is defined for each of the apparatuses. The control unit determines, based on at least one of the first processing data, whether or not to modify the recipe, the second processing data, and the third processing data, modifies the at least one of the recipes if the recipe needs to be modified, and operates at least one of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on the modified recipe.

An electronic device manufacturing system capable of obtaining metrology data generated using metrology equipment located within a process chamber that performs a deposition process on a substrate according to a process recipe, wherein the process recipe comprises a plurality of setting parameters, and wherein the deposition process generates a plurality of film layers on a surface of the substrate. The manufacturing system can further generate a correction profile based on the metrology data. The manufacturing system can further generate an updated process recipe by applying the correction profile to the process recipe. The manufacturing system can further cause an etch process to be performed on the substrate according to the updated process recipe.

A method of altering a rate of executing a motion plan by a computer-numerically-controlled machine can include: receiving, at a control unit of a computer-numerically-controlled machine and from a general purpose computer that is housed separately from the computer-numerically-controlled machine, a motion plan defining operations for causing movement of a moveable component of the computer-numerically-controlled machine; and altering, in response to a command received at the computer-numerically-controlled machine, a first execution rate of the operations to a second execution rate of the operations to change a rate of movement of the movable component. Systems and articles of manufacture, including computer program products, are also provided.

An etching method includes: disposing a target substrate which includes silicon and silicon-germanium in a chamber; supplying the chamber with processing gas which comprises H.sub.2 gas and Ar gas in an excited state; and selectively etching the silicon with respect to the silicon-germanium by the processing gas which is in the excited state. Due to this configuration, silicon can be etched, with high selectivity, with respect to the silicon-germanium.

A computer-implemented method for generating laser engraving instructions for performing a patterning process on a workpiece surface includes receiving a first input value indicating a first laser-pulse pattern and a second input value for a laser parameter associated with a laser-engraving system; and generating a machine-command sequence for the laser-engraving system based on the first input value and the second input value.

A device comprising: a bracket adapted to be coupled to a distal end of a robotic arm; a tool holder coupled to said bracket and configured for changeably receiving a first portion of a stone working tool, wherein said tool is movable in a reciprocating axial direction; a driving element for driving said tool distally along said axial direction during a power stroke of said device; and a guiding element for changeably receiving a body portion of said tool and for guiding said tool in said axial direction, wherein said guiding element is configured to resiliently return said tool proximally along said axial direction after said power stroke.

A machining program creating apparatus includes a tool-route generating unit sequentially executing, concerning each line segment, processing for setting an end point of a set tool route as an endpoint of interest and setting a line segment connected to the endpoint of interest as a next tool route and an NC-machining-program-creation processing unit creating the NC machining program. When a line segment not set as a tool route yet is present among line segments connected to the endpoint of interest, the tool-route generating unit sets the line segment not set as a tool route as a next tool route, and, otherwise, the tool route generating unit sets a line segment already set as a tool route as a tool route again between the endpoint of interest and an endpoint forming a line segment not set as a tool route yet.

A harsh environment camera system. The system can include an enclosure having an electronics compartment and a camera compartment with a camera opening. A camera module is disposed within the camera compartment and one or more electronic components capable of generating heat are positioned in the electronics compartment. A compressed gas connector, connectable to a gas source, can be mounted on the enclosure. A metering orifice having an inlet and an outlet is in fluid communication with the connector. The metering orifice is operative to cool a gas flowing therethrough, thereby condensing moisture from the gas. A gas conduit is in fluid communication with the outlet of the orifice and extends through the electronics compartment to the camera compartment. A portion of the gas conduit is positioned in close proximity to the one or more electronic components, whereby the gas is heated prior to entering the camera compartment.