A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

Disclosed is droplet ejecting apparatus that ejects droplets of a functional liquid onto a workpiece to draw a pattern. The droplet ejecting apparatus includes: a workpiece table; a droplet ejecting head configured to eject the droplets onto the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the droplet ejecting head in a main scanning direction and a sub-scanning direction; and a control unit configured to: detect a position of the workpiece or a position of the workpiece table while relatively moving the workpiece table and the droplet ejecting head along a plurality of scanning lines extending in the main scanning direction and set side by side in the sub-scanning direction; and create, based on a detection result, a correction table that indicates a correlation between a position of the movement mechanism and a positional correction amount of the workpiece table.

Systems and methods for dispensing a liquid or viscous material onto a substrate are disclosed herein. One exemplary method of positioning an applicator of a dispensing system to apply a liquid or viscous material to an electronic substrate includes generating a two-dimensional image of the electronic substrate using a camera communicatively connected to the dispensing system. Based on the two-dimensional image of the electronic substrate, a first set of one or more sub-regions of the electronic substrate having one or more components that protrude above the surface of the electronic substrate is identified. The method further includes using height information relating to the one or more sub-regions having the one or more components to determine a control program for the dispensing system to position the applicator relative to the electronic substrate and dispense the liquid or viscous material onto the electronic substrate.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

A method of inspection and repair of a robotic operation is provided. The robotic operation preferably includes dispensing material onto a surface of a component. A camera is used to capture an image of the robotic operation and identify defects in the robotic operation in the captured image. The locations of the defects are then transformed from the image coordinate system to the robot coordinate system. The robot may then be moved to the defect locations in the robot coordinate system to repair the defects, e.g., by dispensing additional material at the defect.

A system for applying material to a part includes an application nozzle attached to a distal end of a robotic arm, a sensor coupled to the distal end of the robotic arm, an actuator mechanically coupled to the application nozzle, and a controller in communication with the actuator and configured to receive data from the sensor and detect a feature of the substrate. The robotic arm is configured to hold the application nozzle in a fixed position and/or traverse a predefined path such that the application nozzle traverses a predefined global bead path across and spaced apart from a substrate. The controller is configured to direct the actuator to move the application nozzle independent of the distal end of the robotic arm such that a bead of material flowing out of the application nozzle is applied to the substrate along a feature-relative bead path.

A robot control device that controls a robot and includes a processor which extracts a contour of a target based on an image of the target captured by an imaging device, generates a point sequence corresponding to the contour, and converts coordinates of the point sequence into coordinates in a robot coordinate system. Further, a robot control device that controls a robot includes a processor which extracts a contour of a target based on an image of the target captured by an imaging device and a predetermined instruction, generates a point sequence corresponding to the contour, and converts coordinates of the point sequence into coordinates in a robot coordinate system.

A computing system may direct a first robotic arm to a first position based on a first set of coordinates. The computing system may cause the first robotic arm to engage with a first structure based on the first position of the first robotic arm. Further, the computing system may direct the first robotic arm to a second position based on a second set of coordinates such that the first structure is brought within a joining proximity of a second structure without a fixture retaining the first structure and without a fixture retaining the second structure, wherein the first structure is configured to be joined with the second structure when the first and second structures are within the joining proximity, the joining proximity being a proximity at which the first and second structures can be joined together.

A method of detecting a defect in an applied volume of material includes detecting a pressure discontinuity during dispensing the volume of material along a predetermined path on a substrate. The pressure discontinuity is indicative of the defect in the applied volume of material. The location of the defect along the predetermined path is function of a start time of the pressure discontinuity and the size of the defect is a function of a time duration of the pressure discontinuity. The method can further include determining whether or not to repair the defect as a function of the location and the size of the defect in the applied volume of material. The method includes repairing the defect by re-directing the material applicator to the location of the defect and dispensing additional material at the location of the defect.

Systems and methods for dispensing a liquid or viscous material onto a substrate are disclosed herein. One exemplary method of positioning an applicator of a dispensing system to apply a liquid or viscous material to an electronic substrate includes generating a two-dimensional image of the electronic substrate using a camera communicatively connected to the dispensing system. Based on the two-dimensional image of the electronic substrate, a first set of one or more sub-regions of the electronic substrate having one or more components that protrude above the surface of the electronic substrate is identified. The method further includes using height information relating to the one or more sub-regions having the one or more components to determine a control program for the dispensing system to position the applicator relative to the electronic substrate and dispense the liquid or viscous material onto the electronic substrate.