A material removal system may control movement of a material removal machine based on whether a material removal tool is in contact with a sample. A material removal system may include a material removal machine (e.g., saw, grinder, polisher, and/or more general material preparation and/or testing machine) that is configured to move at the urging of one or more actuators. The system may further include control circuitry configured to control movement (and/or speed, acceleration, etc.) of the material removal machine (e.g., via the actuators) based on one or more power, thermal, position, and/or other parameters that indicate whether the material removal tool of the material removal machine is in contact with a sample.

In some examples, a material removal system may control movement of a material removal machine based on whether a material removal tool is in contact with a sample. A material removal system may include a material removal machine (e.g., saw, grinder, polisher, and/or more general material preparation and/or testing machine) that is configured to move at the urging of one or more actuators. The system may further include control circuitry configured to control movement (and/or speed, acceleration, etc.) of the material removal machine (e.g., via the actuators) based on one or more power, thermal, position, and/or other parameters that indicate whether the material removal tool of the material removal machine is in contact with a sample.

A compensation quantity acquisition device acquires vibration of the movement target in a second axis direction, orthogonal to the first axis direction when the movement target is moved in the first axis direction, acquires a positional frequency characteristic by performing Fourier transformation on the acquired vibration in the second axis direction, performs inverse Fourier transformation on the positional frequency characteristic from which the component of position independent frequency in the second axis direction (that occurs independently of a position of the movement target in the first axis direction) has been removed, to recover the vibration of the movement target in the second axial direction as position dependent vibration, and acquires positional compensation quantity of the movement target in the second axis direction that cancels the position dependent vibration.

Systems, and/or methods for movement control of material removal systems and/or assemblies are disclosed, such as saws, grinders, polishers, and/or more general material preparation and/or testing machines, for example. A material removal system may include a material removal machine that is configured to move at the urging of one or more actuators. The system may further include control circuitry configured to control movement (and/or speed, acceleration, etc.) of the material removal assembly (e.g., via the actuators) based on one or more power, thermal, position, and/or other parameters that indicate whether the material removal tool is in contact with a sample.

A compensation quantity acquisition device acquires vibration of the movement target in a second axis direction, orthogonal to the first axis direction when the movement target is moved in the first axis direction, acquires a positional frequency characteristic by performing Fourier transformation on the acquired vibration in the second axis direction, performs inverse Fourier transformation on the positional frequency characteristic from which the component of position independent frequency in the second axis direction (that occurs independently of a position of the movement target in the first axis direction) has been removed, to recover the vibration of the movement target in the second axial direction as position dependent vibration, and acquires positional compensation quantity of the movement target in the second axis direction that cancels the position dependent vibration.

A method for controlling a device system is disclosed, and the device system includes a tool device and a motorized advancing apparatus during the machining of a workpiece composed of a first material and a second material different from the first material. The method includes machining the workpiece by the device system initially in a first operating mode with first machining parameters that are stored for the first material. After the start of the machining of the workpiece in the first operating mode, the method includes measuring and storing a first machining progress of the tool device as a reference value. During the machining of the workpiece in the first operating mode, the method also includes regularly measuring and comparing with a first threshold value a current machining progress of the tool device.

The present invention discloses a method and system for machining a work piece by a machining tool, and a robot system using the same. The method comprises: defining a customized contact point on the machining tool by setting a contact point height of the machining tool; moving the machining tool against the work piece to apply predefined machining feeds. Compared with the existing prior arts, the proposed method and system improves machining efficiency and accuracy. With the method and system according to the present disclosure, high machining efficiency could be achieved as well as collisions could be avoided.