Patent classifications
G05B2219/49191
METHODS OF ADJUSTING A TILT BETWEEN A BONDING TOOL ASSEMBLY AND A SUPPORT STRUCTURE ASSEMBLY OF A BONDING SYSTEM, AND RELATED BONDING SYSTEMS
A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system is provided. The method includes the steps of: (a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system; (b) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly; and (c) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly in response to the vacuum leakage sensed in step (b).
PROCESSING PROGRAM CREATION DEVICE AND PROCESSING PROGRAM CREATION METHOD
A topology database generates topology data of a plurality of parts. The topology database acquires processing information including a tool name of a use tool and a processing order from a bending processing program of each part, and stores the processing information in association with the topology data. A processing information acquisition unit searches for a similar part with the same topology data as topology data of a processing target part, and acquires the processing information of the similar part. A tool determination unit calculates a range of a tool length which is able to bend each bending line using a tool with a tool name included in the processing information and which does not interfere with the part, and determines the tool with the tool name and a tool length within a range of the tool length as the use tool.
Articulated-arm robot and method for machining a workpiece by means of the articulated-arm robot
An articulated-arm robot and a method for machining a workpiece by means of the articulated-arm robot includes a base; a working head holder; several lever arms, which are arranged between the base and the working head holder, the lever arms being coupled to one another by means of revolute joints; a working head which is arranged on the working head holder, the working head comprising a working spindle which is arranged in a spindle housing and is mounted in the spindle housing at least at a first bearing point and a second bearing point. At least one sensor for sensing a radial force is formed at each of the first bearing point and the second bearing point. At least one sensor for sensing an axial force is formed at least one of the two bearing points.
ARTICULATED-ARM ROBOT AND METHOD FOR MACHINING A WORKPIECE BY MEANS OF THE ARTICULATED-ARM ROBOT
An articulated-arm robot and a method for machining a workpiece by means of the articulated-arm robot includes a base; a working head holder; several lever arms, which are arranged between the base and the working head holder, the lever arms being coupled to one another by means of revolute joints; a working head which is arranged on the working head holder, the working head comprising a working spindle which is arranged in a spindle housing and is mounted in the spindle housing at least at a first bearing point and a second bearing point. At least one sensor for sensing a radial force is formed at each of the first bearing point and the second bearing point. At least one sensor for sensing an axial force is formed at least one of the two bearing points.
Positioning device
A positioning device is adapted for positioning a tool at a setpoint position on a flat substrate in an X-Y plane, the tool exerting a process force in its axial direction perpendicularly onto the substrate. The tool includes a multicomponent force sensor to measure unwanted process-force components in the lateral direction. The setpoint position of the tool is correctable by the positioning device such that the lateral process-force components are minimized.
Processing program creation device and processing program creation method
A topology database generates topology data of a plurality of parts. The topology database acquires processing information including a tool name of a use tool and a processing order from a bending processing program of each part, and stores the processing information in association with the topology data. A processing information acquisition unit searches for a similar part with the same topology data as topology data of a processing target part, and acquires the processing information of the similar part. A tool determination unit calculates a range of a tool length which is able to bend each bending line using a tool with a tool name included in the processing information and which does not interfere with the part, and determines the tool with the tool name and a tool length within a range of the tool length as the use tool.
Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system
A method of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system is provided. The method includes the steps of: (a) bringing a bonding tool assembly of a bonding system into contact with a support structure assembly of the bonding system; (b) sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly; and (c) adjusting a tilt of at least one of (i) the bonding tool assembly and (ii) the support structure assembly in response to the vacuum leakage sensed in step (b).
POSITIONING DEVICE
A positioning device is adapted for positioning a tool at a setpoint position on a flat substrate in an X-Y plane, the tool exerting a process force in its axial direction perpendicularly onto the substrate. The tool includes a multicomponent force sensor to measure unwanted process-force components in the lateral direction. The setpoint position of the tool is correctable by the positioning device such that the lateral process-force components are minimized.
METHODS OF ADJUSTING A TILT BETWEEN A BONDING TOOL ASSEMBLY AND A SUPPORT STRUCTURE ASSEMBLY OF A BONDING SYSTEM, AND RELATED BONDING SYSTEMS
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bonding tool assembly for bonding a semiconductor element to a substrate. The bonding system also includes a support structure assembly for supporting the substrate. The bonding system further includes a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during contact therebetween. The vacuum sensor is also used in connection with a tilt adjustment between the bonding tool assembly and the support structure assembly.