Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.

A heat dissipation control method is disclosed, wherein the heat generation speed of a heat dissipation channel may be calculated according to a power consumption value of each component in the heat dissipation channel, and a radiator is then controlled on the basis of the heat generation speed, whereby the heat dissipation speed of the heat dissipation channel is comparable to the heat generation speed. A heat dissipation control apparatus and device are further disclosed, which have the same beneficial effects as the heat dissipation control method.

Examples for controlling an operating speed of a cooling device based on an operating mode of a processing unit, are described. In an example, a current value of a monitored current signal is determined. Based on the comparison of the current value with a predefined threshold value, a switch in an operating mode of the processing unit is determined. Thereafter, the computing device may be caused to increase the operating speed of the cooling device to a designated speed.

A system for controlling one or more fans, comprising an open loop control system configured to receive a CPU power level and to maintain a fan speed at an open loop fan speed level. A closed loop control system configured to receive the CPU power level and temperature, and to modify the fan speed as a function of the CPU power level and temperature, wherein the fan speed is maintained at a level that is not lower than the open loop fan speed level.

Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.

A method may include determining whether a fault has occurred in connection with a distribution unit for a fluidic network. The method may also include operating a plurality of three-way valves in a normal mode of operation in absence of the fault, wherein in the normal mode, the coolant fluid flows in parallel through the heat exchanger and the fluidic network. The method may also include operating the plurality of three-way valves in a failure mode in response to the fault, wherein in the failure mode, the coolant fluid flows in serial through the heat exchanger, then the fluidic network.

A computing cooling system includes a chassis, heat dissipation device(s) in the chassis, a first fan system in the chassis configured to generate a first airflow that is directed past the heat dissipation device(s) and out of the chassis, and a second fan system in the chassis configured to generate a second airflow that is that is directed into the chassis. A board in the chassis includes a first board section located adjacent the first fan system, and a second board section located adjacent the second fan system and configured to receive the second airflow. The first board section includes first components that are thermally coupled to the heat dissipation device(s) and that are configured to operate in a first temperature range, and the second board section includes second components that are configured to operate in a second temperature range that is lower than the first temperature range.

A computing device cooling system includes a chassis including chassis surface(s). The chassis houses component(s), chassis surface temperature sensor(s) configured to report a chassis surface temperature associated with the chassis surface(s), component temperature sensor(s) configured to report a component temperature associated with the component(s); a first fan system configured to generate a component cooling airflow that reduces the component temperature of the component(s), and a second fan system configured to generate a chassis surface cooling airflow that reduces the chassis surface temperature of the chassis surface(s). A fan control system is coupled to the chassis surface temperature sensor(s), the component temperature sensor(s), the first fan system, and the second fan system. The fan control system operates the first fan system when a component temperature exceeds a component temperature threshold, and operates the second fan system when a chassis surface temperature exceeds a chassis surface temperature threshold.

In an example implementation according to aspects of the present disclosure, a system includes a thermal sensor and a processor. The processor determines that a workload surpasses a high workload threshold. The processor determines that the workload transcends a low workload threshold after the workload abates. The processor determines a measured thermolysis curve based on a reading from the thermal sensor. The processor compares the measured thermolysis curve against a target thermolysis curve and generates a filter event based on the comparing.

LED operation rules correlating device event, LED action, LED color, and optionally LED brightness are specified in software. As devices connect to a host computer, a correlation between device ID and USB port is detected. A port map for the storage system is used to correlate the location of a USB port where the electronic device connected to a set of LEDs on the storage system. As the states of the electronic devices connected to the storage system change, the custom-defined LED operational rules are applied on the LEDs of the storage system to cause the LEDs identified by the LED operational rules to be illuminated. Since the LED operational rules are customizable, a user can cause any combination of LED action, color, and brightness to be associated with any electronic device state.