Patent classifications
G05B2219/50063
INFORMATION PROCESSING DEVICE, MACHINING SYSTEM, MACHINE TOOL, AND PROGRAM
An information processing device to process a two-dimensional image generated by an imaging unit in a machine tool including an attachment unit to which the imaging unit or a tool is attachable, the attachment unit moving to image an image of a workpiece placed in the machine tool, the imaging unit imaging the image of the workpiece at an imaging position, the information processing device including a computation unit for (i) calculating a position of the workpiece based on an image imaged after the imaging unit has moved to a predetermined position based on machine coordinates of the machine tool, and (ii) detecting an edge of the workpiece from the two-dimensional image imaged by the imaging unit at an imaging position after the imaging unit has been moved from the predetermined position to the imaging position, and calculating a length of the workpiece from detected edges.
System and method to derive and apply computer numerical control global offsets during part measurement on coordinate measuring machine
A method to derive and apply computer numerical control global offsets includes: measuring features of a machined part using a coordinate measuring machine (CMM); programming a first processor within the CMM to receive the dimensions of the features and to output computer numerical control (CNC) offsets; and forwarding the CNC offsets from the CMM to a CNC machining system to correct operation of the CNC machining system.
METHOD FOR ALIGNING A WORKPIECE IN A MACHINE TOOL
A method for aligning a workpiece in a working space of a machine tool having a numerical control system uses a probe. 3D models of the working space, probe, and workpiece are virtually displayed. The workpiece is positioned in the working space and the virtual workpiece is positioned in the virtual working space so that there is an initial coincidence between positions thereof. The probe is manually positioned relative to the workpiece, wherein a planned probing point and probing direction are selected based on a minimum distance of the virtual probe from the virtual workpiece, and are displayed. Enabling of the probing is based on quality of the planned probing point, and, when enabled, a probing operation is triggered, and coordinates of a probing point are determined. The position of the workpiece is recalculated using these coordinates, and the position of the virtual workpiece is updated.
Correction value measurement method and correction value measurement system of position measurement sensor in machine tool
A correction value measurement method includes, measuring a position of a reference sphere, calculating a relative position of the reference sphere with respect to a sensing position from the position of the reference sphere, a length of the position measurement sensor, and a length of the reference tool. The method further includes acquiring a reference tool position as a distal end position of the reference tool using, calculating a length direction correction value of the position measurement sensor from the reference tool position, the position of the reference sphere, the relative position, and a length of the reference tool, and measuring the position of the reference sphere to calculate a radial direction correction value of the position measurement sensor.
Method for cutting a gear and gear-cutting machine
A method for machining a toothing of a workpiece held in a clamping, in which a toothing tool that rotates about its rotational axis and comprises cutting edges is brought into rolling chip-removing machining engagement with the toothing that rotates about its rotational axis, in order to produce a predetermined tooth flank end geometry in one or more machining passes, wherein during the machining pass which produces the tooth flank end geometry, monitoring responsive to the event of a removed chip being pressed into a machined tooth flank of the toothing by means of the rolling machining process is carried out and, if the monitoring responds, an additional toothing machining process that removes the material protrusion on top of the tooth flank end geometry formed by the chip that was pressed in is implemented automatically, which process is carried out in the same clamping of the workpiece and by means of the toothing tool.
Machine tool apparatus
A touch trigger probe interface for a machine tool is described that includes a probe communication portion for receiving probe event information from a touch trigger probe. A machine tool communication portion is also provided for outputting probe event information to a numerical controller of the machine tool. The machine tool communication portion outputs the probe event information as digital data packets, for example over a digital data bus. The digital data packets may include a time stamp and/or the touch trigger probe interface may receive timing information from the machine tool. A touch trigger probing system and a machine tool system including the probe interface are also described.
Method for controlling a power tool and power tool configured for carrying out the method
A method for controlling a power tool includes ascertaining a workpiece characteristic of the workpiece to be processed from previously acquired measured values, determining the workpiece material from the workpiece characteristic of the workpiece to be processed, specifying initial values, which are suitable for processing the workpiece made of the determined workpiece material using the power tool, for machine parameters such as feed, speed, and torque, storing the initial values for putting the power tool into operation with machine parameters set to the initial values and/or putting the power tool into operation with machine parameters set to the initial values. A cooling constant is ascertained according to the Newtonian cooling law as the workpiece characteristic of the workpiece to be processed. To ascertain the cooling constant, the ambient temperature is measured, the workpiece is heated, and the actual temperature of the workpiece is measured, whereupon the cooling constant is computed.
System and method for adaptive positioning of a work piece
The Invention is a system and method for adaptively attaching a work piece, especially an imprecise work piece, to a non-adaptive fixture that can be repeatably attached to one or more CNC machines. The Invention allows a work piece to be set up once for multiple machining operations. The Invention avoids the potential for errors and the cost and complexity inherent in adaptive machining and adaptive fixturing.
Position measurement method and position measurement system of object in machine tool, and computer-readable recording medium
A position measurement method includes, acquiring a sensing position of a distal end of a reference tool, measuring and acquiring a position of a machined surface, The method further includes measuring a position of a reference block disposed on a side of the tool sensor and calculating a relative position of the reference block to the sensing position from the sensing position and the position of the reference block, mounting the position measurement sensor to the main spindle and measuring a position of the reference block, calculating a length direction correction value of the position measurement sensor from the position of the reference block measured in the mounting of the position measurement sensor and the relative position, and measuring the object by the position measurement sensor and correcting a measurement position of the object.
Wafer processing apparatus and wafer processing method using the same apparatus
A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.