Disclosed is an automatic hole-processing method with self-adapting adjustment of processing parameters, including the following steps: performing tool feeding, detecting whether the rotate speed changes or not, if changes, judging the type of the processing material according to the new rotate speed after stabilization (if not, the tool feeding is continued); feeding the tool according to the processing parameters suitable for the material, detecting whether the rotate speed changes or not, if changes, judging whether the hole processing has been completed or not according to the new rotate speed after stabilization (if not, the tool feeding is continued), if completed, retracting the tool with the set parameters (if not, judging the type of the processing material according to the new rotate speed after stabilization, and repeating the above steps), completing the hole processing. During the hole processing in the present disclosure, there is no need to know the type of workpiece material of each processing hole in advance and to set processing parameters for each material respectively; there is no need for axial tool setting, processing parameters can be changed automatically after the tool contacts the workpiece; there is no need to know the total thickness of each processing hole material in advance and to set the feed stokes respectively, after cutting through the workpiece, the tool automatically identifies and begins to retract.

A method is presented. A machine head is positioned in a desired location relative to a material on a tool using a sensor connected to the machine head and calibrated to detect magnetic material in the tool. An operation is performed on the material using the machine head starting at the desired location.

A method is presented. A machine head is positioned in a desired location relative to a material on a tool using a sensor connected to the machine head and calibrated to detect magnetic material in the tool. An operation is performed on the material using the machine head starting at the desired location.