G05B2219/50285

GEOMETRIC CONTROL AND BEST FITTING OF ELECTRIC DISCHARGE MACHINING TOOLS
20170259363 · 2017-09-14 · ·

A method for checking a geometry of an electric discharge machining electrode is described. The method comprises the following steps: providing a file containing a native 3D-model of the electric discharge machining electrode; providing a manufactured electric discharge machining electrode based on the native 3D-model; light scanning a set of images of the manufactured electric discharge machining electrode in different positions and generating therewith a scanned 3D-model of the manufactured electric discharge machining electrode; comparing the native 3D-model and the scanned 3D-model and generating electrode compensation coordinates for an electric discharge machining apparatus, to correct an electrode path during electric discharge machining.

WORKPIECE MACHINING METHOD AND WORKPIECE MACHINING DEVICE
20220063040 · 2022-03-03 · ·

A workpiece machining device includes a positional deviation correction unit configured to correct a positional deviation of a radius end mill by detecting a positional deviation between a real contour line and an ideal contour line of the radius end mill. The positional deviation correction unit calculates a first correction value configured to make a center of a first arc section formed into an arc shape at a corner portion of the ideal contour line and a center of a second arc section formed into an arc shape at a corner portion of the real contour line to be identical to each other in a plane perpendicular to the rotational axis, and corrects a machining point by the radius end mill using the first correction value.

Geometric control and best fitting of electric discharge machining tools
10850339 · 2020-12-01 · ·

A method for checking a geometry of an electric discharge machining electrode is described. The method comprises the following steps: providing a file containing a native 3D-model of the electric discharge machining electrode; providing a manufactured electric discharge machining electrode based on the native 3D-model; light scanning a set of images of the manufactured electric discharge machining electrode in different positions and generating therewith a scanned 3D-model of the manufactured electric discharge machining electrode; comparing the native 3D-model and the scanned 3D-model and generating electrode compensation coordinates for an electric discharge machining apparatus, to correct an electrode path during electric discharge machining.

Methods and system for controlling a surface profile of a wafer

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

Workpiece machining method and workpiece machining device
11938580 · 2024-03-26 · ·

A workpiece machining device includes a positional deviation correction unit configured to correct a positional deviation of a radius end mill by detecting a positional deviation between a real contour line and an ideal contour line of the radius end mill. The positional deviation correction unit calculates a first correction value configured to make a center of a first arc section formed into an arc shape at a corner portion of the ideal contour line and a center of a second arc section formed into an arc shape at a corner portion of the real contour line to be identical to each other in a plane perpendicular to the rotational axis, and corrects a machining point by the radius end mill using the first correction value.

METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

Methods and system for controlling a surface profile of a wafer

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.

A METHOD AND SYSTEM FOR MACHINING, AND A ROBOT SYSTEM
20180141184 · 2018-05-24 ·

The present invention discloses a method and system for machining a work piece by a machining tool, and a robot system using the same. The method comprises: defining a customized contact point on the machining tool by setting a contact point height of the machining tool; moving the machining tool against the work piece to apply predefined machining feeds. Compared with the existing prior arts, the proposed method and system improves machining efficiency and accuracy. With the method and system according to the present disclosure, high machining efficiency could be achieved as well as collisions could be avoided.

METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.