The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and/or out of a building.

A method can include obtaining a set of images of a set of occupants located in an interior environment. The interior environment can have a first temperature. The method can include identifying, based on the set of images, a set of occupant characteristics corresponding to the set of occupants. The method can include obtaining a second temperature of an external environment. The method can include generating, by comparing the set of occupant characteristics to the second temperature, a discrepancy factor. The method can include determining that the discrepancy factor exceeds a threshold. The method can include initiating, in response to the determining that the discrepancy factor exceeds the threshold, a modification of the first temperature.

A method can include obtaining a set of images of a set of occupants located in an interior environment. The interior environment can have a first temperature. The method can include identifying, based on the set of images, a set of occupant characteristics corresponding to the set of occupants. The method can include obtaining a second temperature of an external environment. The method can include generating, by comparing the set of occupant characteristics to the second temperature, a discrepancy factor. The method can include determining that the discrepancy factor exceeds a threshold. The method can include initiating, in response to the determining that the discrepancy factor exceeds the threshold, a modification of the first temperature.

A thermostatic valve, including: a pressure relief ring capable of moving up and down and disposed in a valve body cavity. In normal conditions, the pressure relief ring is abutted against the outer edge of a first valve seat via a spring. An internal channel capable of being opened or closed via up and down movement of the pressure relief ring is further provided in the valve body cavity; when the pressure of a fluid in the thermostatic valve is excessive, the fluid can drive the pressure relief ring to compress the spring, such that the internal channel is in communication with a third interface to realize simultaneous communication with a first flow channel and a third flow channel.

Disclosed is a thermostatic valve, including: a pressure relief ring capable of moving up and down and disposed in a valve body cavity. In normal conditions, the pressure relief ring is abutted against the outer edge of a first valve seat by means of a spring. An internal channel capable of being opened or closed by means of up and down movement of the pressure relief ring is further provided in the valve body cavity; when the pressure of a fluid in the thermostatic valve is excessive, the fluid can drive the pressure relief ring to compress the spring, such that the internal channel is in communication with a third interface to realize simultaneous communication with a first flow channel and a third flow channel, and thus damages caused by excessive pressure of the fluid in the temperature regulating valve can be prevented.

Electrical and electromechanical devices often require maintaining a specific temperature, or a narrow range or temperatures, during operation. An assembly regulates the temperature of a device by providing a variable thermal resistance between the device and a heatsink. The device can be mounted to a base having a high thermal resistance, the base thermally isolating the device from the heatsink. At low environmental temperatures, the base enables the device to rise to its operating temperature as a result of the device's waste heat, and with no or minimal use of a heater. As the environmental temperature increases, a working fluid, having a low thermal resistance, undergoes thermal expansion to fill a portion of a volume in the base between the device and the heat sink, lowering the thermal resistance between the device and the heatsink to maintain the device at the required operating temperature.

The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and/or out of a building.

The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and/or out of a building.

Electrical and electromechanical devices often require maintaining a specific temperature, or a narrow range or temperatures, during operation. An assembly regulates the temperature of a device by providing a variable thermal resistance between the device and a heatsink. The device can be mounted to a base having a high thermal resistance, the base thermally isolating the device from the heatsink. At low environmental temperatures, the base enables the device to rise to its operating temperature as a result of the device's waste heat, and with no or minimal use of a heater. As the environmental temperature increases, a working fluid, having a low thermal resistance, undergoes thermal expansion to fill a portion of a volume in the base between the device and the heat sink, lowering the thermal resistance between the device and the heatsink to maintain the device at the required operating temperature.

The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and/or out of a building.