G05D23/1928

FLUID-HEATING DEVICE, IN PARTICULAR FOR A VEHICLE

The present invention relates to an electric fluid-heating device (1), in particular for a motor vehicle, comprising a housing having a first fluid-circulation chamber (21), at least one electric heating element (4) for heating the fluid in said first chamber (21), an electronic board (81) for controlling a current circulating in said electric heating element or elements (4), at least one thermal sensor. Said device is characterised in that the thermal sensor or sensors are positioned on the electronic board (81) and thermally connected to the first chamber (21) via a heat sink (9).

DEVICE FOR ASSESSING AND MANAGING A HEALTH IMPACT OF AN INDOOR ENVIRONMENT AT A SITE LOCATION

A system and a method include receiving, by a processor, from environmental sensors, environmental output data measurements. The environmental sensors are located at a site location. An health impact scoring algorithm computes a plurality of health impact scores from the environmental output data measurements. An overall health impact score at the site location is computed from the any of the health impact scores having a lowest value. A machine learning model generates at least one recommendation for remediating at least one verified environmental hazard type. At least one of the overall health impact score, the at least one verified environmental hazard type, or the at least one recommendation are displayed on a computing device. An instruction is sent to environment-controlling equipment located at the site location to change an operational parameter of the environment-controlling equipment to mitigate the at least one verified environmental hazard type.

DEVICE HEATER MODULE
20230086310 · 2023-03-23 ·

A device heater module can be installed within a device such as a server, and can prevent the device from powering on while the temperature of the device is being restored to an operating temperature. The device heater module can prevent the device from powering on by operating a switch to disconnect the device from an external power supply. The device heater module can thereafter actively or passively modify the temperature of the device. After the temperature of the device is restored to within the operating temperature, the device heater module can operate the switch to reconnect the device to the external power supply, thereby allowing the device to initiate a boot process.

Method for heating a wide bandgap substrate by providing a resistive heating element which emits radiative heat in a mid-infrared band
11629401 · 2023-04-18 · ·

Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band from 5 μm to 40 μm that corresponds to a phonon absorption band of the substrate. The substrate comprises a wide bandgap semiconducting material and has an uncoated surface and a deposition surface opposite the uncoated surface. The resistive heater and the substrate are positioned in a vacuum deposition chamber. The uncoated surface of the substrate is spaced apart from and faces the resistive heater. The uncoated surface of the substrate is directly heated by absorbing the radiative heat.

PROBE ASSEMBLY FOR A COOKING APPLIANCE

A probe assembly for a cooking appliance includes an outer case that includes a cap, a body, and retention features that are coupled to each of the cap and the body. A first temperature sensor is operably coupled to the cap of the outer case. A probe is operably coupled to the body of the outer case and is selectively concealed by the cap. A second temperature sensor is operably coupled to the probe. A controller is communicatively coupled to each of the first temperature sensor and the second temperature sensor. The controller is configured to receive a first signal from the first temperature sensor when the cap is directly coupled to the body of the outer case.

METHODS AND SYSTEMS FOR HEATING A WIDE BANDGAP SUBSTRATE
20230203643 · 2023-06-29 · ·

Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band from 5 μm to 40 μm that corresponds to a phonon absorption band of the substrate. The substrate comprises a wide bandgap semiconducting material and has an uncoated surface and a deposition surface opposite the uncoated surface. The resistive heater and the substrate are positioned in a vacuum deposition chamber. The uncoated surface of the substrate is spaced apart from and faces the resistive heater. The uncoated surface of the substrate is directly heated by absorbing the radiative heat.

Body temperature measurement devices, methods, and systems

A patient's body temperature measurement may be made by varying the heat transfer dynamics of a fluid exiting the patient's body and fitting parameters of heat transfer configuration to measurements under the varied conditions. Then the input temperature of the patient core can be extracted from the model and a current temperature measurement remote from the patient core and optionally other measurements such as fluid flow rate.

State-based control in an air handling unit

A state-based control system for an air handling unit (AHU) includes a finite state machine configured to transition between a high cooling load state and a low cooling load state. In the high cooling load state, the system maintains the temperature of a supply airstream provided by the AHU at a fixed setpoint and controls the temperature of a building zone by modulating the speed of a supply air fan. In the low cooling load state, the system operates the supply air fan at a fixed speed and controls the zone temperature by modulating an amount of cooling applied to the supply airstream by one or more cooling stages. A feed-forward module manages disturbances caused by adding or shedding cooling stages by applying a feed-forward gain to the supply air fan setpoint.

COOKING DEVICE AND METHOD OF COOKING FOOD ITEM BASED ON PREDICTING FOOD CORE TEMPERATURE
20170224161 · 2017-08-10 ·

The invention provides a cooking device comprising a heating chamber (10), a heating element (12) for heating a cooking medium in the heating chamber, a temperature sensor (14) for monitoring a temperature of the cooking medium over time, and a mass sensor (16) for monitoring a mass of a food item to be cooked in the heating chamber over time. The cooking device also comprises a controller (18) for processing information from the mass sensor and temperature sensor to provide a prediction of the food item core temperature and to control a cooking process in dependence on the predicted food item core temperature.

WALL MODULE WITH MULTI-PIXEL PASSIVE INFRARED SENSOR

A wall module of a building control system is described that is configured to capture a thermal image using a passive infrared (PIR) sensor four or more individually readable pixels arranged in two or more rows and two or more columns. Based on the thermal image, the wall module may, for example, automatically activate and/or deactivate a backlight of a display of the wall module