An integrated circuit that controls distributed temperature sensors in a semiconductor die is described. This integrated circuit may include: memory; a controller (such as a PTAT controller) coupled to the memory; temperature sensors distributed at measurement locations in the semiconductor die (such as remote locations from the controller), where a given temperature sensor includes building blocks (or components) that are common to the temperature sensors; and routing between the controller and the building blocks over an addressable bus, where signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors.

An integrated circuit that controls distributed temperature sensors in a semiconductor die is described. This integrated circuit may include: memory; a controller (such as a PTAT controller) coupled to the memory; temperature sensors distributed at measurement locations in the semiconductor die (such as remote locations from the controller), where a given temperature sensor includes building blocks (or components) that are common to the temperature sensors; and routing between the controller and the building blocks over an addressable bus, where signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors.

An integrated circuit that controls distributed temperature sensors in a semiconductor die is described. This integrated circuit may include: memory; a controller (such as a PTAT controller) coupled to the memory; temperature sensors distributed at measurement locations in the semiconductor die (such as remote locations from the controller), where a given temperature sensor includes building blocks (or components) that are common to the temperature sensors; and routing between the controller and the building blocks over an addressable bus, where signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors.

An apparatus includes a power transistor to conduct a load current from a supply voltage node to an output node and a current sense circuit coupled to the power transistor. The current sense circuit generates a current sense current proportional to the load current. A temperature sense circuit is included to generate a temperature sense voltage proportional to the temperature of the power FET. A thermal limit circuit is coupled to the temperature sense circuit. A current limit circuit is coupled to the current sense circuit and to the thermal limit circuit. The current limit circuit generates a control signal on a current limit circuit output node. The control signal is responsive to the current sense current and to a first current from the thermal limit circuit. The current limit circuit output node is coupled to a control input of the power transistor.

An apparatus includes a power transistor to conduct a load current from a supply voltage node to an output node and a current sense circuit coupled to the power transistor. The current sense circuit generates a current sense current proportional to the load current. A temperature sense circuit is included to generate a temperature sense voltage proportional to the temperature of the power FET. A thermal limit circuit is coupled to the temperature sense circuit. A current limit circuit is coupled to the current sense circuit and to the thermal limit circuit. The current limit circuit generates a control signal on a current limit circuit output node. The control signal is responsive to the current sense current and to a first current from the thermal limit circuit. The current limit circuit output node is coupled to a control input of the power transistor.

A display panel and a temperature regulation method for a display panel are provided. The display includes a substrate, a thin film transistor layer, a first passivation layer, a photoelectric detector, a first light-shielding layer, and a second light-shielding layer. The first light-shielding layer is disposed on one side of the photoelectric detector away from the substrate. The second light-shielding layer is disposed on the lateral of the photoelectric detector.

A system and method of operating a water supply system with one or more water consuming appliances includes a water heater fluidly coupled to a water consuming appliance through a supply conduit. The water consuming appliance includes an appliance communication module for communicating a target temperature. A mixing valve is positioned on the supply conduit, is in operative communication with the appliance communication module, and heats water from the water heater and cold water from the water supply to provide a flow of supply water to the water consuming appliance at the target temperature.

A unit which combines a remotely programmable controller with an integral temperature and level sensor for controlling the temperature and level of a given liquid. The device comprises one temperature sensor, to measure a liquid's temperature and to provide an electrical output; one level sensor, to measure a liquid's level and provide an electrical output; a programmable scaling and control module, for receiving the electrical outputs of the temperature sensor and level sensor as input signals, for scaling the temperature signal as a function of temperature and a scale-selection input, and for implementing a control logic to process the sensor signals into two respective control signals; two electronic switching devices, to electrically interface one of the two control signals to an external heater or cooling unit and the other one of the two control signals to an auxiliary device, such as a pump or alarm.

A system for regulating a temperature of a measurement array is disclosed. The system includes a measurement array including a plurality of sensors, wherein the plurality of sensors are integrated onto an integrated circuit die. The system includes a thermal sensor integrated onto the integrated circuit die, wherein the thermal sensor senses a temperature associated with the plurality of sensors. The system further includes a heat pump coupled to the integrated circuit die, wherein the heat pump is controlled by a feedback control circuit including the thermal sensor.

A system and method of operating a water supply system with one or more water consuming appliances is provided. A water supply system includes a water heater fluidly coupled to a water consuming appliance through a supply conduit. The water consuming appliance includes an appliance communication module for communicating a target temperature. A mixing valve is positioned on the supply conduit and is in operative communication with the appliance communication module. The mixing valve mixes heated water from the water heater and cold water from the water supply to provide a flow of supply water to the water consuming appliance at the target temperature. The water supply system may further include a second water consuming appliance, a second supply conduit, and a second mixing valve for providing the second water consuming appliance with a flow of heated water at a different set point temperature.