The present disclosure relates to a heating, ventilation, and air conditioning (HVAC) system including a sensor system configured to detect heat indications within a plurality of areas of a conditioned space, wherein the sensor system comprise a thermal light detector, and a controller configured to receive feedback from the sensor system and, based on the feedback, control airflow distribution, via an airflow distribution system, such that airflow management for each of the plurality of areas is individually correlated to a heat indication detected for the respective area.

The present disclosure relates to a heating, ventilation, and air conditioning (HVAC) system including a sensor system configured to detect heat indications within a plurality of areas of a conditioned space, wherein the sensor system comprise a thermal light detector, and a controller configured to receive feedback from the sensor system and, based on the feedback, control airflow distribution, via an airflow distribution system, such that airflow management for each of the plurality of areas is individually correlated to a heat indication detected for the respective area.

Apparatus and methods for measuring the concentrations of organic and inorganic carbon, or of other materials in aqueous samples are described, having a reactor that is resistively heated by passing an electric current through the reactor.

The present disclosure discloses a heating apparatus for a semiconductor device. The heating apparatus includes a carrier including a first abutting part, a heat collecting plate at least including a working surface, and a heat radiation source disposed on a side of the heat collecting plate opposite to the working surface and separated from the heat collecting plate by a predetermined distance. The heat collecting plate is disposed on the carrier, and the first abutting part abuts against an edge of the heat collecting plate on the side opposite to the working surface. The heat radiation source is and configured to emit heat radiation during working and to heat the heat collecting plate in a non-contact manner. The heat collecting plate receives the heat radiation and the emitted heat and heats a heated object disposed on the working surface in a contact manner.

The present disclosure discloses a heating apparatus for a semiconductor device. The heating apparatus includes a carrier including a first abutting part, a heat collecting plate at least including a working surface, and a heat radiation source disposed on a side of the heat collecting plate opposite to the working surface and separated from the heat collecting plate by a predetermined distance. The heat collecting plate is disposed on the carrier, and the first abutting part abuts against an edge of the heat collecting plate on the side opposite to the working surface. The heat radiation source is and configured to emit heat radiation during working and to heat the heat collecting plate in a non-contact manner. The heat collecting plate receives the heat radiation and the emitted heat and heats a heated object disposed on the working surface in a contact manner.

A heating station for use with, for example, a high speed parallel manufacturing line for manufacturing insulated glass units, the heating station including at least two opposing infrared heaters that linearly heat spacer material that includes integrated temperature sensitive adhesive. Each of multiple linear infrared heaters includes a respective associated temperature sensor. The infrared heater and temperature sensor are coupled to a spacer heating controller that controls intensity and/or duration of heating of the spacer material and adhesive to provide optimal wetting and adhesive qualities. Individual control of the at least two opposing linear infrared heaters compensates for variable environmental conditions affecting spacer material at different locations around and insulated glass unit.

A heating station for use with, for example, a high speed parallel manufacturing line for manufacturing insulated glass units, the heating station including at least two opposing infrared heaters that linearly heat spacer material that includes integrated temperature sensitive adhesive. Each of multiple linear infrared heaters includes a respective associated temperature sensor. The infrared heater and temperature sensor are coupled to a spacer heating controller that controls intensity and/or duration of heating of the spacer material and adhesive to provide optimal wetting and adhesive qualities. Individual control of the at least two opposing linear infrared heaters compensates for variable environmental conditions affecting spacer material at different locations around and insulated glass unit.

A control valve includes a casing, a valve body, seal tube members, a fuel passage, and a thermostat. The casing has an inflow port and a plurality of outflow ports. The valve body is rotatably disposed inside the casing, and valve holes are formed in a circumferential wall portion. The seal tube members communicate with the outflow ports, abut an outer circumferential surface of the circumferential wall portion, and are opened and closed by corresponding valve holes. Thermostat opens and closes the fuel passage in response to a detected temperature. A communication groove is formed on an inner circumferential surface of the casing. The communication groove causes the inflow port and an upstream portion of the fuel passage to communicate with each other by partially expanding a gap between the circumferential wall portion and the casing.

An object temperature regulator system for a vehicle for managing the temperature of a part of an object inside of the vehicle, the object temperature regulator system includes: at least one camera sensor; at least one object temperature regulator device configured to provide cooling and/or heating in a proximity to the object temperature regulator device; and a processing circuitry operatively connected to the camera sensor and the object temperature regulator device, the processing circuitry is configured to cause the object temperature regulator system to: detect a part of an object inside of the vehicle in image data obtained by the camera sensor; and control cooling or heating of the part of the detected object by the object temperature regulator device.

An object temperature regulator system for a vehicle for managing the temperature of a part of an object inside of the vehicle, the object temperature regulator system includes: at least one camera sensor; at least one object temperature regulator device configured to provide cooling and/or heating in a proximity to the object temperature regulator device; and a processing circuitry operatively connected to the camera sensor and the object temperature regulator device, the processing circuitry is configured to cause the object temperature regulator system to: detect a part of an object inside of the vehicle in image data obtained by the camera sensor; and control cooling or heating of the part of the detected object by the object temperature regulator device.