A computing card support system, including: a cage positioned on a PCB, including: a first support structure; a second support structure; a cover that is removably coupled to the support structures and positioned opposite to the PCB, the cover including a grounding material positioned along an inner surface of the cover, the inner surface of the cover facing the PCB; computing cards that are i) coupled to the PCB at a first end of each respective computing card and ii) positioned within the cage, each of the computing cards including conductive pads positioned at a second end opposite to the first end of the respective computing card, wherein the computing cards extend from the PCB toward the cover such that the grounding material of the cover is in contact with the conductive pads of each of the computing cards to provide electrical grounding of the computing cards.

A voltage stacked system that includes a stack of near threshold computing (NTC) chips for achieving inter-chip communication with simple wires as interconnections is disclosed. The chips include at least two secondary supply voltages and at least a secondary ground voltage electrically coupled to the stack of the chips arranged in series. The secondary supply and ground voltages are tapped in a predefined sequence at one or more predefined access points in the stack to generate two versions of an internal voltage within each of the chips. Each of the two versions of the internal voltage is a voltage difference between respective supply voltages and ground voltages, and the two have a set voltage shift such that the chips in the stack have supply voltages overlapping with those in the neighboring chips. Optionally, the two voltages are boosted to further higher voltages as needed using charge pumps.

The disclosure provides a computer device. The computer device includes a base, a host case, and a display support. The base includes an upper surface and includes a power module therein. The host case is detachably fixed to the base and electrically connected to the power module through the upper surface. One end of the display support is connected to the base, and the other end thereof includes a display connection structure.

A power distribution system includes a plurality of power distribution modules connected to at least one power supply and configured to receive power therefrom. A power distribution bus connects the power distribution modules of the plurality of power distribution modules in parallel. The plurality of power distribution modules executes a distributed system policy management protocol over the power distribution bus to control a supply of available power from the at least one power supply to loads connected to USB charging ports of the power distribution modules.

The present disclosure relates to the field of display technology, and provides an array substrate and a display panel. The array substrate is provided with a via hole and further includes an annular wiring area. The annular wiring area is located around the via hole and is provided with an incision extending toward an outer edge of the annular wiring area along an inner edge of the annular wiring area, and at least a portion of the annular wiring area is bent toward a side away from a display side along the inner edge.

An electrostatic discharge protection circuit, a display substrate and a display apparatus are disclosed. The electrostatic discharge protection circuit includes: a first conductive portion, having an end portion; and at least one electrostatic discharge portion, arranged on a same layer as the first conductive portion and spaced from the end portion of the first conductive portion, the at least one electrostatic discharge portion being configured to discharge electrostatic charges generated at the end portion of the first conductive portion.

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

A memory module assisting in efficient heat dissipation includes a motherboard, a plurality of fixing devices, a plurality of memory cards, and a plurality of dummy memory cards. The fixing devices are fixed on the motherboard side by side. The memory cards are fixed on some of the fixing devices as necessary, and the dummy memory cards are fixed on the remaining fixing devices which are vacant. The dummy memory cards inserted into the vacant fixing devices prevent the flow of air through the space above the vacant fixing devices. An electronic device including the memory module is also disclosed.

Provided are a terminal device and a folding display screen thereof. The folding display screen includes a flexible display panel and an axis-variable folding assembly arranged on a back of the flexible display panel. The axis-variable folding assembly includes a shaft body and magnetic coils positioned to the shaft body. The shaft body includes a flexible outer layer connected to the flexible display panel and a plurality of magnetic beads wrapped by the flexible outer layer. The plurality of magnetic beads are movable relative to each other in a folding motion of the axis-variable folding assembly. Upon a change in a current supplied to the magnetic coils, the magnetic coils can generate a variable magnetic field to adjust an arrangement of the plurality of magnetic beads wrapped by the flexible outer layer.

Disclosed is a technology that supplies a signal to a panel driving integrated circuit (IC). A plurality of signals having different characteristics are stably provided to a panel driving IC according to a display operation or a touch operation, by controlling capacitance connected to a transmission conduction wire.