G06F1/20

Carbon Negative Data Centers and Services
20230049241 · 2023-02-16 ·

Captured data center waste-heat is used as the input energy for carbon capture plant. Energy in the form of waste-heat is first captured from servers and other apparatus within the data center and optionally directed as the input to a heat-pump before being directed to the input of carbon capture plant, enabling carbon capture using a data centers waste-heat. Also disclosed are systems and apparatus for data center operators or cloud services to offer carbon negative or carbon neutral services to their customers. Cloud customers are offered options to select a carbon negative or carbon neutral service, the cloud operator storing their choice and then operating or managing carbon capture services to meet their requests.

FOLDABLE SCREENS AND DISPLAY APPARATUSES

A foldable screen comprises a plurality of display regions spaced apart in a first direction and one or more foldable regions located between two adjacent ones of the display regions, the foldable screen further comprising a supporting layer and a heat dissipation layer arranged in a stack, where the supporting layer is bendable and is arranged in the display regions and the foldable regions; and the heat dissipation layer is bendable and is arranged in the display regions and the folding regions, and portions of the heat dissipation layer corresponding to the foldable regions are provided with through hole arrays. A display device comprising the foldable screen is further disclosed.

SIZEABLE CONDUITS

According to an example, a conduit sizeable in length and width comprises a first cover and a second cover. The first cover comprises a first interfacing area between a first component and a second component. The second cover comprises a second interfacing area between a third component and a fourth component. The first cover and the second cover comprise a third interfacing area.

SIZEABLE CONDUITS

According to an example, a conduit sizeable in length and width comprises a first cover and a second cover. The first cover comprises a first interfacing area between a first component and a second component. The second cover comprises a second interfacing area between a third component and a fourth component. The first cover and the second cover comprise a third interfacing area.

SCENARIO TEMPERATURE PLANNING METHOD and DEVICE, AND storage MEDIUM
20230045944 · 2023-02-16 ·

The present application provides a scenario temperature planning method and apparatus, a computer device, and a medium, where the scenario temperature planning method includes: obtaining original data in a current temperature planning cycle in a target scenario, where the original data is data generated based on a user's temperature adjustment operation; performing data merging and data elimination processing on the original data to obtain valid data; and adjusting temperature planning data of the current temperature planning cycle based on the valid data to obtain temperature planning data of a next temperature planning cycle of the current temperature planning cycle, so as to adjust a temperature in a target scenario in the next temperature planning cycle. The technical solution enables the adjusted temperature to meet the user's temperature requirements without requiring the user to manually plan and set the temperature, thereby improving user experience.

BROADBAND SYMPATHETIC ELECTROMAGNETICALLY-INDUCED TRANSPARENCY (EIT) COOLING
20230050581 · 2023-02-16 ·

An atomic object confined in a particular region of an atomic object confinement apparatus is cooled using an S-to-P-to-D EIT cooling operation. A controller associated with the atomic object confinement apparatus controls first and second manipulation sources to respectively provide first and second manipulation signals to the particular region. The first manipulation signal is characterized by a first wavelength corresponding to a transition between an S manifold and a P manifold of a first component of the atomic object and detuned from the S-to-P transition by a first detuning. The second manipulation signal is characterized by a second wavelength corresponding to a transition between the P manifold and a D manifold of the first component and detuned from the P-to-D transition by a second detuning. The first and second detunings selected to establish a dark state associated with a two-photon transition between the S manifold and the D manifold.

BROADBAND SYMPATHETIC ELECTROMAGNETICALLY-INDUCED TRANSPARENCY (EIT) COOLING
20230050581 · 2023-02-16 ·

An atomic object confined in a particular region of an atomic object confinement apparatus is cooled using an S-to-P-to-D EIT cooling operation. A controller associated with the atomic object confinement apparatus controls first and second manipulation sources to respectively provide first and second manipulation signals to the particular region. The first manipulation signal is characterized by a first wavelength corresponding to a transition between an S manifold and a P manifold of a first component of the atomic object and detuned from the S-to-P transition by a first detuning. The second manipulation signal is characterized by a second wavelength corresponding to a transition between the P manifold and a D manifold of the first component and detuned from the P-to-D transition by a second detuning. The first and second detunings selected to establish a dark state associated with a two-photon transition between the S manifold and the D manifold.

COMPUTING CARD SUPPORT SYSTEM FOR AN INFORMATION HANDLING SYSTEM
20230048850 · 2023-02-16 ·

A computing card support system, including: a cage positioned on a PCB, including: a first support structure; a second support structure; a cover that is removably coupled to the support structures and positioned opposite to the PCB, the cover including a grounding material positioned along an inner surface of the cover, the inner surface of the cover facing the PCB; computing cards that are i) coupled to the PCB at a first end of each respective computing card and ii) positioned within the cage, each of the computing cards including conductive pads positioned at a second end opposite to the first end of the respective computing card, wherein the computing cards extend from the PCB toward the cover such that the grounding material of the cover is in contact with the conductive pads of each of the computing cards to provide electrical grounding of the computing cards.

ELECTRONIC DEVICE FOR CONTROLLING SURFACE HEAT AND METHOD OF OPERATING THE ELECTRONIC DEVICE

Provided is an electronic device for controlling surface heart and a method of controlling the electronic device. The electronic device includes a speaker, a temperature sensor, a memory, and a processor electrically coupled to the speaker, the temperature sensor, and the memory. The processor obtains first temperature information based on impedance information measured in a coil included in the speaker; obtains second temperature information measured by the temperature sensor, the second temperature information based on a heat source disposed adjacent to the speaker; predicts a surface temperature of a surface area of the electronic device, opposite to an internal area in which the speaker is disposed, based on the first temperature information and the second temperature information using a nonlinear approximation function; and controls an audio signal input to the speaker based on the predicted surface temperature.

System and Method for Distributed Data Processing
20230052131 · 2023-02-16 ·

A distributed data processing system includes a processing center or algorithm persistence system (“APS”), a series of remote caching nodes in electronic communication with the APS, and a series of remote computing or processing nodes in electronic communication with the remote caching nodes. Each remote caching node is mounted to a top surface of a mobile vehicle and includes a data transmitter/receiver (transceiver), computer hardware and software to operate the caching node, memory to transmit or transfer data from the APS to the remote processing nodes. The remote processing nodes include a series of electricity generating solar panels, a series of electronic data processing chips, electronic data memory, an electronic date transmitter/receiver (transceiver), and a motion sensor. The series of electronic data processing chips are preferably a tensor processing unit (TPU), which is an AI accelerator application-specific integrated circuit (ASIC) developed specifically for neural network machine learning.