An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling volume or range.

The present disclosure provides a method and an apparatus for testing a semiconductor device. The method includes providing an active area in an integrated circuit design layout; grouping the active area into a first region and a second region; calculating a first self-heating temperature of the first region of the active area; calculating a second self-heating temperature of the second region of the active area; and determining an Electromigration (EM) evaluation based on the first self-heating temperature and the second self-heating temperature.

A computer-implemented method, computer program, system and apparatus for computing a thermal thickness and providing pre-manufacturing feedback on a design of a three-dimensional physical object that is to be formed by solidification of a fluid in a mold. An equation is solved, representing heat release through the cavity-mold interface when the object is formed. The thermal thickness and its uniformity provide insight in the manufacturability of the object, and may be used to automatically generate pre-manufacturing feedback. The thermal thickness and pre-manufacturing feedback are transmitted or displayed to a user.

A recoater collision prediction and calibration method for additive manufacturing and a system thereof are provided. The recoater collision prediction and calibration method includes the following steps: loading a printing image file to generate a simulated printing object according to the printing image file; performing a process thermal stress simulation on the simulated printing object to obtain a plurality of simulated deformation variables respectively corresponding to a plurality of prediction results of the simulated printing object in a vertical direction on each layer; obtaining an experimental collision height of an experimental printed object; selecting one of the plurality of simulated deformation variables according to the experimental collision height; calculating a recoater tolerance according to the one of the plurality of simulated deformation variables; calibrating a collision risk formula according to the recoater tolerance; and predicting a collision risk value between the simulated printing object and a recoater according to the collision risk formula.

Integrated process-structure-property modeling framework and method for design optimization and/or performance prediction of a material system are provided. The Integrated process-structure-property modeling framework includes a powder spreading model using a discrete element method to generate a powder bed; a thermal-fluid flow model of the powder melting process to predict voids and temperature profile; a cellular automaton model to simulate grain growth based on the temperature profile; and a reduced-order micromechanics model to predict mechanical properties and fatigue resistance of resultant structures by resolving the voids and grains.

The disclosure presents processes for improving the design phase of plastic material lined tubular structures used downhole of a borehole. A plastic material lined tubular structure model is utilized for tubular structures that have a metal layer, a grout layer, and a plastic material layer. The model can use a modified wall thickness for the metal layer. A strength model can be applied to the modified critical dimensions, e.g., wall thickness parameters. A thermal model can be applied to the tubular structure to determine pressure and temperature parameters. The strength model and the thermal model outputs can be utilized by a stress analyzer to determine loads, safety factors, and design limit parameters. The plastic material lined tubular structure model can enable more efficient use of tubular structures, designing a longer operational lifetime, such as in acidic environments, or the use of thinner structures while maintaining a satisfactory operational lifetime.

A process manufacturing method, a method for adjusting a threshold voltage, a device, and a storage medium are provided. One form of a process manufacturing method includes: determining a type of to-be-formed MOS device and a corresponding threshold voltage interval; obtaining, according to a MOS device type and the corresponding threshold voltage interval, a corresponding threshold voltage adjustment process by querying a pre-configured first mapping relationship of the threshold voltage interval and a second mapping relationship of the threshold voltage interval; and establishing a process flow according to the corresponding threshold voltage adjustment process, the first mapping relationship being a mapping relationship between the threshold voltage interval and the MOS device type; and the second mapping relationship being a correspondence between the threshold voltage interval in the first mapping relationship and a threshold voltage adjustment process formed by at least one adjustment process selected from a preset process flow, the threshold voltage adjustment process causing a threshold voltage to be in the corresponding threshold voltage interval under the action of a total threshold voltage offset. According to the present disclosure, the difficulty in adjusting the threshold voltage is reduced.

Described are computer-related techniques for determining rotation direction of an axial fan for use in fluid flow simulations. The techniques involve receiving by a computer processing system digital data of a three dimensional representation of an axial fan having plural fan blade, determining by the computer processing system from the data of three dimensional representation of the axial fan, at least a single centerline of a single blade of the axial fan from a two dimensional projection of the axial fan, and calculating by the computer processing system based on the initial valve of fan rotation, an actual value of fan rotational direction.

Systems and methods related to learning-based analyzers (both supervised and unsupervised) for mitigating latch-up in integrated circuits are provided. An example method includes obtaining latch-up data concerning at least one integrated circuit configured to operate under a range of temperature conditions, where the at least one integrated circuit comprises a core portion including at least a plurality of devices each having one or more structural features formed using a lithographic process, and an input/output portion. The method further includes training the learning-based system based on training data derived from the latch-up data and a first layout rule concerning a first spacing between the core portion and the input/output portion. The method further includes using the learning-based system generating a second layout rule concerning the first spacing between the core portion and the input/output portion, where the second layout rule is different from the first layout rule.

An example of an apparatus is provided. The apparatus includes an input device to receive design data. The design data includes information about a geometry and load characteristics of an object. The apparatus further includes a structural design engine to generate print data to print the object on a three-dimensional printer based on the design data. The apparatus also includes a fluid design engine to generate fluidic data. The fluidic data represents a fluid channel within the object. In addition, the apparatus includes an output engine to generate an output file based on the print data and the fluidic data.