A discrete three-dimensional (3-D) processor comprises first and second dice. The first die comprises 3-D random-access memory (3D-RAM) arrays, whereas the second die comprises logic circuits and at least an off-die peripheral-circuit component of the 3D-RAM arrays. The first die does not comprise the off-die peripheral-circuit component of the 3D-RAM arrays.

Disclosed is a two-stage frequency selection method and device for microwave frequency sweep data. The method includes: acquiring microwave frequency sweep data; performing frequency selection on the microwave frequency sweep data by using a random forest-recursive feature elimination algorithm, taking a preset parameter in the random forest-recursive feature elimination algorithm as a hyper-parameter, changing the value of the hyper-parameter, and generating a series of candidate frequency subsets within different frequencies; building prediction models on the basis of the frequency sweep data corresponding to the candidate frequency subsets of different frequencies; evaluating the performance of each prediction model by means of 10 fold cross validation, and calculating evaluation index values of model performance; and taking the evaluation indexes as a voting basis, and selecting an optimal frequency subset by using a majority voting method.

Disclosed is a two-stage frequency selection method and device for microwave frequency sweep data. The method includes: acquiring microwave frequency sweep data; performing frequency selection on the microwave frequency sweep data by using a random forest-recursive feature elimination algorithm, taking a preset parameter in the random forest-recursive feature elimination algorithm as a hyper-parameter, changing the value of the hyper-parameter, and generating a series of candidate frequency subsets within different frequencies; building prediction models on the basis of the frequency sweep data corresponding to the candidate frequency subsets of different frequencies; evaluating the performance of each prediction model by means of 10 fold cross validation, and calculating evaluation index values of model performance; and taking the evaluation indexes as a voting basis, and selecting an optimal frequency subset by using a majority voting method.

A method for analyzing a viewing direction of an electronic component includes inputting a package type and a file image of an electronic component, with the file image having at least one engineering drawing image, and the at least one engineering drawing image being a view of the electronic component in at least one viewing direction; querying and acquiring a viewing direction detection model meeting the package type from a database, with the database storing respective viewing direction detection models of different package types of electronic components; inputting the file image into the viewing direction detection model of the package type to identify the viewing direction of the at least one engineering drawing image; and outputting the viewing direction of the at least one engineering drawing image of the electronic component.

A system for locating according to a data description includes an interface and a processor. The interface is configured to receive the data description. The processor is configured to create a model-based item identification job based at least in part on the data description; provide the model-based item identification job to a set of vehicle event recorder systems, wherein the model-based item identification job uses a model to identify sensor data resembling the data description; receive the sensor data from the set of vehicle event recorder systems; and store the sensor data associated with the model-based item identification job.

Embodiments described herein provide systems and processes for scene-aware object detection. This can involve an object detector that modulates its operations based on image location. The object detector can be a neural network detector or a scanning window detector, for example.

Methods, systems, and apparatus, including computer programs encoded on computer storage media, for detecting intermediate reinforcement learning goals. One of the methods includes obtaining a plurality of demonstration sequences, each of the demonstration sequences being a sequence of images of an environment while a respective instance of a reinforcement learning task is being performed; for each demonstration sequence, processing each image in the demonstration sequence through an image processing neural network to determine feature values for a respective set of features for the image; determining, from the demonstration sequences, a partitioning of the reinforcement learning task into a plurality of subtasks, wherein each image in each demonstration sequence is assigned to a respective subtask of the plurality of subtasks; and determining, from the feature values for the images in the demonstration sequences, a respective set of discriminative features for each of the plurality of subtasks.

An inference apparatus comprises a plurality of PEs (Processing Elements) and a control part. The control part operates a convolution operation in a convolutional neural network using each of a plurality of pieces of input data and a weight group including a plurality of weights corresponding to each of the plurality of pieces of input data by controlling the plurality of PEs. Further, each of the plurality of PEs executes a computation including multiplication of a single piece of the input data by a single weight and also executes multiplication included in the convolution operation using an element with a non-zero value included in each of the plurality of pieces of input data.

A discrete three-dimensional (3-D) processor comprises stacked first and second dice. The first die comprises 3-D memory (3D-M) arrays, whereas the second die comprises logic circuits and at least an off-die peripheral-circuit component of the 3D-M array(s). In one preferred embodiment, the first and second dice are face-to-face bonded. In another preferred embodiment, the first and second dice have a same die size.

A discrete three-dimensional (3-D) processor comprises first and second dice. The first die comprises 3-D memory (3D-M) arrays, whereas the second die comprises logic circuits and at least an off-die peripheral-circuit component of the 3D-M array(s). Typical off-die peripheral-circuit component could be an address decoder, a sense amplifier, a programming circuit, a read-voltage generator, a write-voltage generator, a data buffer, or a portion thereof.