A method for analyzing an analog circuit controlled by a plurality of digital inputs is presented. The circuit is represented with a data structure with nodes connected via edges, which represent a circuit component. The data structure can be traversed across all connected nodes; and said digital inputs can be toggled between two or more input states. The method steps include identifying a set of boundary nodes in the data structure which are at a digital-analog boundary of the data structure; for each digital input, identifying associated boundary nodes which are coupled with the digital input; grouping digital inputs into input sets, where each of the different input sets are associated with mutually exclusive sets of associated boundary nodes, and analyzing the circuit by successively analyzing one or more of the input sets for all possible combinations of inputs states within that set.

A method for determining an electrical model of a string of photovoltaic modules from a characteristic I(V) of the string includes detecting a first linear zone and a second linear zone of the characteristic I(V); initialising the parameters of a non-by-pass electrical model corresponding to a first operating condition, called a non-by-pass condition; optimising the parameters of the non-by-pass electrical model from a reference characteristic I(V.sub.ref) equal to I(V), determining the parameters of the electrical model corresponding to a second operating condition, called a by-pass condition, in order to obtain a by-pass electrical model from the characteristic determining, from the characteristic I(V) the best model among the non-by-pass model and the by-pass model.

A method for determining an electrical model of a string of photovoltaic modules from a characteristic I(V) of the string includes detecting a first linear zone and a second linear zone of the characteristic I(V); initialising the parameters of a non-by-pass electrical model corresponding to a first operating condition, called a non-by-pass condition; optimising the parameters of the non-by-pass electrical model from a reference characteristic I(V.sub.ref) equal to I(V), determining the parameters of the electrical model corresponding to a second operating condition, called a by-pass condition, in order to obtain a by-pass electrical model from the characteristic determining, from the characteristic I(V) the best model among the non-by-pass model and the by-pass model.

Automated circuit and layout generation is disclosed. Various embodiments may include a computer system and/or method for generating a circuit layout comprising specifying a circuit schematic to be converted to a circuit layout, receiving a layout script associated with the circuit schematic, the layout script configured to position a plurality of layout instances generated from the circuit schematic, converting the circuit schematic into the plurality of layout instances; and positioning the plurality of layout instances based on the layout script to produce the circuit layout. A circuit may be produced by fabricating a circuit using the layout.

Automated circuit and layout generation is disclosed. Various embodiments may include a computer system and/or method for generating a circuit layout comprising specifying a circuit schematic to be converted to a circuit layout, receiving a layout script associated with the circuit schematic, the layout script configured to position a plurality of layout instances generated from the circuit schematic, converting the circuit schematic into the plurality of layout instances; and positioning the plurality of layout instances based on the layout script to produce the circuit layout. A circuit may be produced by fabricating a circuit using the layout.

The present disclosure generally relates to an analog mixed-signal (AMS) design verification system. In particular, the present disclosure relates to a system and method for system verification. One example method includes: obtaining an electronic representation of the circuit design; generating at least a portion of a waveform using the electronic representation of the circuit to obtain a first segment of the waveform associated with the circuit; converting, via the one or more processors, one or more measurement functions to code for performing the one or more computations on the first segment of the waveform; performing one or more computations on the first segment of the waveform using the code; and identifying when a behavior of the circuit violates a design specification based on whether a result of the one or more computations meets a threshold.

The present disclosure generally relates to an analog mixed-signal (AMS) design verification system. In particular, the present disclosure relates to a system and method for system verification. One example method includes: obtaining an electronic representation of the circuit design; generating at least a portion of a waveform using the electronic representation of the circuit to obtain a first segment of the waveform associated with the circuit; converting, via the one or more processors, one or more measurement functions to code for performing the one or more computations on the first segment of the waveform; performing one or more computations on the first segment of the waveform using the code; and identifying when a behavior of the circuit violates a design specification based on whether a result of the one or more computations meets a threshold.

A method includes instantiating a simulation of an electronic design for a device under test (DUT) in hardware design language responsive to a user selection thereof. A subset of leaf nodes from a plurality of leaf nodes from the electronic design with input/output signaling of more than two values is identified. A hierarchical path for each leaf node of the plurality of leaf nodes of the electronic design for the DUT with respect to a testbench is calculated. A bypass module for the subset of leaf nodes is generated. The bypass module is generated in response to detecting presence of the subset of leaf nodes in the electronic design with input/output signaling of more than two values. The bypass module facilitates communication between the testbench and the subset of leaf nodes. Leaf nodes other than the subset of leaf nodes communicate with the testbench without communicating through the bypass module.

A method, apparatus, computer device, and storage medium for automatic design of analog circuits based on tree structure. The method includes: setting the maximum height and growth direction of the tree structure; randomly calling the node from the function node library as the parent node; randomly calling the node from the function node library and the port node library as the child according to the growth direction node; if the child node is a terminal node, generating a tree structure; checking the tree structure, if the tree structure satisfies the preset conditions, obtaining the circuit topology and device parameter that conform to the circuit rules; evolving the circuit topology and device parameter to generate an analog circuit. The embodiments achieve the effect of making the tree structure of the designed analog circuit more reasonable.

Electronic-photonic packages and related fabrication methods are described. A package may include a plurality of photonic integrated circuits (PICs), where each PIC comprises a photonic accelerator configured to perform matrix multiplication in the optical domain. The package may further include an application specific integrated circuit (ASIC) configured to control at least one of the photonic accelerators. The package further includes an interposer. The plurality of PICs are coupled to a first side of the interposer and the ASIC is coupled to a second side of the interposer opposite the first side. A first thermally conductive member in thermal contact with at least one of the PICs. The first thermally conductive member may include a heat spreader. A second thermally conductive member in thermal contact with the ASIC. The second thermally conductive member may include a lid. The first thermally conductive member faces the first side of the interposer, and the second thermally conductive member faces the second side of the interposer. In some embodiments, the interposer sits in part on a substrate and in part on the PICs.