An RFID assembly that includes both a UHF patch antenna and an HF or LF loop antenna is provided. The patch antenna and the loop antenna are arranged inside a housing in such a manner that the loop antenna partially overlaps an end portion of the patch antenna, thereby forming an extension of the patch antenna. In this manner, a performance of the UHF patch antenna can be maintained despite decreasing the size of the same, while an interference between the patch antenna and the loop antenna can be suppressed, in particular, by providing a gap between the same.

Dual-mode RFID devices are provided with an integrated dual-mode RFID strap including either a UHF/HF dual-mode RFID chip or the combination of a UHF RFID chip and an HF RFID chip. An HF antenna and a UHF antenna are both coupled to the integrated dual-mode RFID strap, with the UHF antenna being formed by an approach other than etching, such as a cutting or printing operation, thereby reducing the cost to manufacture the device. If a pair of chips is employed, one of the chips may have a greater thickness than the other chip, which allows for the thicker chip to be incorporated into the device after the thinner chip without requiring a minimum separation between the two chips due to the size of a thermode used to secure the chips. Additionally, the first chip may be tested before securing the second chip, thereby limiting the cost of a rejected device.

The present description concerns an electronic device including: a modulator-demodulator circuit; a first integrated circuit implementing a first subscriber identification module; and at least one second integrated circuit intended to implement a second subscriber identification module, wherein a sequencing terminal of the first circuit and a sequencing terminal of the second circuit are connected to a same sequencing terminal of the modulator-demodulator circuit.

The present disclosure relates to a radio-frequency identification system for a cryogenic straw comprising: at least one integrated circuit configured to store information and generate a radio-frequency signal in a frequency range of between 30 MHz and 3 GHz; and at least one antenna comprising a conductive thread configured to be integrated, such as molded, into a sidewall of the cryogenic straw. The disclosure further relates to a cryogenic straw comprising at least one antenna, the antenna comprising a conductive thread or rod, wherein the at least one antenna is integrated, such as molded, into a sidewall of the cryogenic straw.

A biological sample storage container and a dual chip wireless identification tag thereof are provided. The dual chip wireless identification tag includes a substrate, an antenna structure, a first chip, and a second chip. The antenna structure is disposed on the substrate, and includes two radiation parts and two matching parts. The two matching parts are connected between the two radiation parts, the first chip is coupled to one of the matching parts, and the second chip is coupled to the other one of the matching parts.

A multimedia card includes a substrate, and a main control chip, a memory chip, and an interface contacts that are disposed on the substrate. The main control chip and the memory chip are covered with a packaging layer. The interface contacts includes a power contact, configured to receive a first voltage that is input from the outside; and a transformer circuit is further disposed on the substrate, is coupled to the interface contacts, the main control chip, and the memory chip, and is configured to convert the input first voltage into a second voltage, to provide two types of power supplies with the first voltage and the second voltage for the main control chip and the memory chip. In the foregoing manner, an area of the multimedia card is reduced, and a quantity of working modes of the multimedia card increases.

A communication card comprises an antenna, a memory, a signal evaluation circuit, an energy supply circuit, a data interface, a signal processing circuit and a supply voltage terminal. The supply voltage terminal is coupled to the signal processing circuit and the memory. In a commissioning phase, the energy supply circuit is configured to receive electrical power via the antenna and provide electrical power to the signal evaluation circuit and the memory, and the signal evaluation circuit is configured to receive configuration data via the antenna and to store the configuration data in the memory. In an operating phase, the communication card is configured to receive electrical power by the supply voltage terminal, and the signal processing circuit is configured to read the configuration data stored in the memory.

An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.

A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

A method and system for programming a smart card using multiple programming protocols in a single card programming station. The card can include at least two programmable chips, with each chip being programmed using a different programming protocol. Alternatively, the card can include a single programmable chip, and the chip is programmed using at least two programming protocols. The card can also include at least two programmable chips, with each chip being programmed using at least two programming protocols.