Aspects of the present disclosure includes a method of manufacturing a radio frequency identification (RFID) tag, including connecting a first wire and a second wire across a chip, maintaining the spaced apart distance between the first wire and the second wire adjacent to each side of the chip to define a spaced apart segment of the first wire and the second wire that forms part of an inductive loop, connecting the first wire and the second wire at each side of the chip distal from and adjacent to the spaced apart segment of the first wire and the second wire to close the inductive loop, define connected wire segments, and to form an RFID assembly, and moving the RFID assembly through a casing material at or above a glass transition temperature of the casing material to encase the RFID assembly.

This RFID tag comprises: a film wiring substrate including a flexible base material having a first surface and a second surface located opposite to the first surface, and conductors located on the first and second surfaces, respectively; and an RFIC IC connected to the conductors, wherein the film wiring substrate is bent, and at least a first conductor part included in the conductor on the first surface, a second conductor part included in the conductor on the first surface or the second surface, and a conductor on the second surface that does not include the second conductor part overlap each other.

An RFID tag includes an RFID IC, flexible substrates including first wiring conductors and rigid substrates including second wiring conductors. Substrate surfaces of the flexible substrates include first regions connected to the rigid substrates and second regions that include opposite surfaces and are not connected to the rigid substrates. First conductor portions and second conductor portions included in the first wiring conductors are electrically connected to each other via the second wiring conductors. The RFID IC is connected to the first wiring conductors, the second wiring conductors, or both the first wiring conductors and the second wiring conductors.

An RFID tag is disclosed comprising a dielectric substrate having a first side and an opposite second side, and with an antenna arranged on the first side of the dielectric substrate. The antenna defines a gap and is configured to operate at an operation frequency. The RFID tag further comprises an RFID chip electrically coupled to the antenna across the gap. A shielding conductor is arranged on the second side of the dielectric substrate, and preferably underlaying the gap, wherein the shielding conductor is configured to limit the voltage across the gap when the antenna is exposed to a microwave frequency of a microwave oven.

Implantable transponders comprising no ferromagnetic parts for use in medical implants are disclosed herein. Such transponders may assist in preventing interference of transponders with medical imaging technologies. Such transponders may optionally be of a small size, and may assist in collecting and transmitting data and information regarding implanted medical devices. Methods of using such transponders, readers for detecting such transponders, and methods for using such readers are also described.

A laminated glazing includes a first substrate having an outer face and an inner face, one or more interlayers disposed on the inner face of the first substrate, a second substrate disposed on the interlayer and at least one data transponder device. The date transponder device includes an antenna and an integrated circuit that is provided between the first substrate and the second substrate Optionally, one or more heating elements is/are provided between the first substrate and the second substrate and spaced around the data transponder device at a pre-defined distance for rapidly heating the antenna the data transponder.

The present disclosure discloses a three-dimensional integration system of an RFID chip and a supercapacitor and a manufacturing method thereof. The three-dimensional integration system of an RFID chip and a supercapacitor includes: a silicon substrate (200); an RFID chip (201) disposed on a front surface of the silicon substrate (200); a supercapacitor disposed on a back surface of the silicon substrate (200) at a position corresponding to the RFID chip (201), but not in contact with the RFID chip (201); through silicon via structures penetrating the silicon substrate (200) and respectively disposed on two sides of the RFID chip (201); wherein the RFID chip (201) has a chip positive electrode (2021) and a chip negative electrode (2022) electrically connected with a capacitor contact positive electrode (2131) and a capacitor contact negative electrode (2132) of the supercapacitor through the through silicon via structures on the two sides respectively; and a packaging substrate (218) electrically connected to the capacitor contact positive electrode (2131) and the capacitor contact negative electrode (2132).

For example, provided is an RFID-bearing flexible material, in which an RFID is attached to a flexible material, the RFID includes an antenna portion, and the antenna portion is formed of a conductive linear body containing a carbon nanotube yarn.

A system for detecting placement or misplacement of an object includes a wireless tag; a first electronic device (“FED”) associated with the tag to automatically detect signals from the tag, determine a position of the FED, transmit the position and status to an external electronic device or network (“EED”) in response to the status indicating that the tag and the FED are within a predetermined range, and transmit the position and status to the EED in response to the status indicating that the tag and the FED are outside of the predetermined range; and a second electronic device (“SED”) that is unassociated with the tag to automatically detect signals from the tag, determine a position of the SED, determine an identifier for the tag using the signals, and transmit the position of the SED and the identifier to the EED.

Discloses a combined ultra-wideband cross-polarized chipless RFID tag based on MFCC feature coding, which comprises a tag patch unit, a dielectric substrate and a grounding layer, wherein the tag patch unit comprises a barcode-type resonant unit and a double L-type resonant unit; the barcode-type resonant unit consists of five identical rectangular patches arranged in parallel and rotated counterclockwise; the double L-type resonant unit is formed by reversely combining two L-type patches composed of four identical rectangular patches; a transmitting antenna transmits horizontally polarized electromagnetic waves as interrogation signals, the scattered waves reflected by the tag are acquired by a receiving antenna, a receiver acquires the spectrum of the scattered waves to convert the spectrum into time domain signals by inverse Fourier transform, the response of the tag is extracted through a window, and MFCC features are extracted by pre-emphasis and short-time Fourier transform.