The present disclosure relates to a method to check if a connector system with a Connector Position Assurance (“CPA”) member is in a closed position. The method includes providing an RFID-tag reader that is positioned at a distance D to the integrated circuit enabling far-field RFID communication and not permitting near-field RFID communication. Further, the method includes checking the readability of the integrated circuit with the RFID-tag reader and issuing an alert signal if the integrated circuit is not readable by the RFID-tag reader indicating that the CPA member is not in the closed position.

The present disclosure is generally directed to an RFID tag for use with a metal fastener where the fastener operates as the antenna of the RFID tag. The RFID tag includes a microchip for storing data. The chip is electrically coupled to the metal fastener in order to receive and transmit the RF signal, the metal fastener thereby operating as the antenna for the RFID tag.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

An electronic card with biometric authentication function includes a communication antenna for short-range wireless communication, a wireless communication IC, a receiving coil, a resonant capacitor, a rectifying and smoothing circuit, a biometric sensor, and a biometric authentication circuit. The communication antenna and the receiving coil respond to a magnetic field in the same frequency band for the short-range wireless communication. The wireless communication IC performs short-range wireless communication. The receiving coil receives power from the magnetic field in the same frequency band for the short-range wireless communication. The biometric authentication circuit causes the biometric sensor to operate by using the power received from the receiving resonant circuit. The communication antenna and the receiving coil share electromagnetic field energy resonating in the same frequency band for the short-range wireless communication, the electromagnetic field energy being shared because of magnetic coupling between the communication antenna and the receiving coil.

Radio frequency identification (RFID) systems for use with tires include a stud comprising reactive strap technology including an RFID chip and conductor. The stud is configured so as to be connected to a tire and to provide near field communication. The stud also may be coupled to an antenna structure to provide a far field RFID tag. The stud may unintentionally move with respect to the antenna structure during use, so the antenna structure may be configured to accommodate such movement without a change in the tuning of the RFID tag. A multi-antenna label may be provided to allow for selective coupling of the stud to a particular antenna, with differently configured tires being coupled to different antennas of the same type of multi-antenna label, which allows for the same label configuration to be used with a wider variety of tires.

A sheet-shaped magnetic marker (1) to be laid on a road surface so as to be able to be detected by a magnetic sensor attached to a vehicle to achieve assist for driving operation of the vehicle by a driver or control on a vehicle side to achieve automatic driving independently from operation of the driver is divided into a plurality of regions in a matrix shape by a cut line (1C) cutting a magnet sheet (11) and a nonskid layer (181), with an adhesive layer being left. Thus, if peeling partially occurs, a region including the peeled part can be isolated, and expansion of peeling can be prevented.

Metal layers (650, 730, 750, 830, 850) of a smartcard (SC, 600, 700, 800) have module openings (614, 712, 714, 812, 814) for receiving a transponder chip module (TCM). Thermosetting resin (TR, 668B, 768A, 768B, 868A, 868B) coats (encapsulates) the bottom surfaces and fills the module openings of the metal layers. A first metal layer (650, 750, 850) may have a slit (S; 620, 720B, 820) which may also be filled by the thermosetting resin. A second metal layer (ML, 730) disposed above the first metal layer (750) may have a slit (S, 720A) which may also be filled by the thermosetting resin. A booster antenna circuit (BAC, 844) may be disposed between the first and second metal layers, with magnetic shielding material (842) disposed between the booster antenna circuit and the second metal layer (730).

A chip packaging structure includes a miniature antenna, an radio frequency identification chip, and a packaging member, wherein the radio frequency identification chip is electrically connected to the miniature antenna, and the packaging member is adapted to encapsulate the miniature antenna and the radio frequency identification chip, and has a top surface, a bottom surface, and a plurality of side surfaces, wherein the top surface, the bottom surface, and the side surfaces substantially form a hexahedron.

A chip packaging structure includes a chip module and a main body, wherein the main body has a first portion, a second portion, and a holding portion. The second portion protrudes from the first portion, and a size of the second portion is less than a size of the first portion. The holding portion is located at the second portion, and the chip module is placed at the holding portion to be engaged with the main body.