The present disclosure provides a verification system. The verification system is formed with a trusted execution environment, the verification system includes a processor set, and the processor set is configured to: obtain an infrared image to be verified of a target object; determine, in the trusted execution environment, whether the infrared image to be verified matches a pre-stored infrared template; in response to determining that the infrared image to be verified matches the pre-stored infrared template, obtain a depth image to be verified of the target object; and determine, in the trusted execution environment, whether the depth image to be verified matches a pre-stored depth template.

The present disclosure provides a verification system. The verification system is formed with a trusted execution environment, the verification system includes a processor set, and the processor set is configured to: obtain an infrared image to be verified of a target object; determine, in the trusted execution environment, whether the infrared image to be verified matches a pre-stored infrared template; in response to determining that the infrared image to be verified matches the pre-stored infrared template, obtain a depth image to be verified of the target object; and determine, in the trusted execution environment, whether the depth image to be verified matches a pre-stored depth template.

A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

The present disclosure discloses a structure for collecting light field information, a display device, and a control method of the display device. The structure for collecting light field information includes a base substrate, a plurality of sensor chips located on the base substrate, where each of the plurality of sensor chips includes a plurality of sensing units arranged in an array, and a plurality of micro-imaging structures located above a side, facing away from the base substrate, of the plurality of sensor chips. Each of the plurality of micro-imaging structures corresponds to a respective one of the sensor chips. An orthographic projection of the respective one sensor chip on the base substrate has an overlapping region with an orthographic projection of the each micro-imaging structure on the base substrate. The respective one sensor chip is configured to receive light field information passing through the each micro-imaging structure.

Systems and methods for brightfield inspection of a circular rotating wafer are provided. A method includes: acquiring a plurality of images of a circular wafer, that is rotating, by using a plurality of line cameras; obtaining a plurality of synchronized images, based on the plurality of images, by synchronizing a motion of the circular wafer, that is rotating, with at least one line camera from among the plurality of line cameras; obtaining a single wafer map by integrating together the plurality of synchronized images; obtaining an in-focus image of the single wafer map while the circular wafer is moving; and performing brightfield inspection of the circular wafer based on the in-focus image of the single wafer map.

Systems and methods for brightfield inspection of a circular rotating wafer are provided. A method includes: acquiring a plurality of images of a circular wafer, that is rotating, by using a plurality of line cameras; obtaining a plurality of synchronized images, based on the plurality of images, by synchronizing a motion of the circular wafer, that is rotating, with at least one line camera from among the plurality of line cameras; obtaining a single wafer map by integrating together the plurality of synchronized images; obtaining an in-focus image of the single wafer map while the circular wafer is moving; and performing brightfield inspection of the circular wafer based on the in-focus image of the single wafer map.

An apparatus and a method are provided for image processing. In one embodiment, the method comprises accessing a plurality of images captured by at least a reference camera, wherein the images represent a plurality of views corresponding to said same scene. A plurality of plane sweep volume (PSV) slices are then generated from said images and computing for each slice a flow map from at least the reference camera calibration parameter and this flow map a previous slice of the plane sweep volume is generated.

An apparatus and a method are provided for image processing. In one embodiment, the method comprises accessing a plurality of images captured by at least a reference camera, wherein the images represent a plurality of views corresponding to said same scene. A plurality of plane sweep volume (PSV) slices are then generated from said images and computing for each slice a flow map from at least the reference camera calibration parameter and this flow map a previous slice of the plane sweep volume is generated.

The present application discloses a positioning method for a movable platform, including: detecting, by a laser positioning system (LPS) mounted on the movable platform, a plurality of reflectors mounted on a target object, wherein the movable platform is moving; calculating in real-time, by the LPS, according to the current position information, relative positions of the plurality of reflectors with respect to the LPS; and obtaining, by the LPS, a relative position of the movable platform with respect to the target object based on the relative positions of the plurality of reflectors with respect to the LPS. The present application also discloses positioning system that performs the positioning method.