G06V40/1329

Fingerprint sensor

A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Sensor-compatible overlay

A fingerprint sensor-compatible overlay material which uses anisotropic conductive material to enable accurate imaging of a fingerprint through an overlay is disclosed. The anisotropic conductive material has increased conductivity in a direction orthogonal to the fingerprint sensor, increasing the capacitive coupling of the fingerprint to the sensor surface, allowing the fingerprint sensor to accurately image the fingerprint through the overlay. Methods for forming a fingerprint sensor-compatible overlay are also disclosed.

DEVICE AND METHOD FOR RECOGNIZING FINGERPRINT

A device for recognizing a fingerprint, includes: a fingerprint sensor; at least two moisture detection electrodes disposed within a preset range of the fingerprint sensor; and a processing module coupled to the fingerprint sensor and the at least two moisture detection electrodes. The fingerprint sensor is configured to output a fingerprint signal to the processing module when a user touches the fingerprint sensor and the at least two moisture detection electrodes with a finger. The processing module is configured to acquire a characteristic value which is positively related to an impedance between the at least two moisture detection electrodes when the user touches the fingerprint sensor and the at least two moisture detection electrodes with the finger; determine a fingerprint recognition parameter which matches the characteristic value; and perform fingerprint recognition according to the determined fingerprint recognition parameter and the fingerprint signal.

FINGERPRINT IMAGE DETECTING DEVICE AND METHOD
20180005031 · 2018-01-04 ·

By use of the characteristics that an analog-to-digital converter sends out data sequentially when it converts data of a two-dimensional analog image into pixel data, a fingerprint image detecting device and method generate digital output data having a plurality of rows of data, generate a plurality of one-dimensional datum segments linearly from the digital output data, and determine whether the two-dimensional analog image is a real fingerprint image according to the plurality of one-dimensional datum segments. Thus, the detection of a fingerprint image is implemented by means of one-dimensional calculation instead of two-dimensional calculation, thereby effectively reducing computational load and computational time.

FINGERPRINT SENSOR, FINGERPRINT SENSOR PACKAGE, AND FINGERPRINT SENSING SYSTEM USING LIGHT SOURCES OF DISPLAY PANEL

At least some example embodiments provide a fingerprint sensor, a fingerprint sensor package, and a fingerprint sensing system using light sources of a display panel. The fingerprint sensor includes an image sensor including a plurality of sensor pixels, the sensor pixels configured to sense light reflected by a fingerprint and generate image information corresponding to the fingerprint and a pinhole mask defining a plurality of pinholes, wherein each of the pinholes forms a focus for transmitting the light reflected by the fingerprint to the image sensor, wherein light is emitted from a plurality of organic light-emitting diodes (OLEDs) and is reflected by the fingerprint.

COVER MEMBER AND DISPLAY APPARATUS

Included are a first cover base including an alkali glass layer, a first alkali-free glass layer provided on one face of the alkali glass layer, and a second alkali-free glass layer provided on another face of the alkali glass layer and a sensor that is provided on the first alkali-free glass layer of the first cover base and includes a plurality of first electrodes configured to detect the unevenness of a surface of an object to be detected that comes into contact with or close to the first cover base and a switching element. At least the first electrodes are formed above the first alkali-free glass layer and in a transmissive area that passes an image.

Fingerprint sensor compatible screen protector

Systems, devices, and methods that ensures that an ultrasonic fingerprint detection process is not interfered with by using a screen protector. An example screen protector for a mobile device is disclosed that is capable of an in-screen fingerprint detection. The screen protector includes a first layer made of a clear rigid material and configured to be touched by a user. The screen protector also includes a second layer beneath the first layer and made of a film. Additionally, the screen protector includes a third layer beneath the second layer and configured to contact the mobile device. The third layer includes a fingerprint conduit configured to facilitate the in-screen fingerprint detection.

A BIOMETRIC SENSOR MODULE FOR CARD INTEGRATION
20230021212 · 2023-01-19 · ·

A biometric sensor module for detecting a biometric feature of a user comprises: a biometric sensor comprising an array of sensing elements for acquiring sensing signals indicative of a biometric feature of a user, the array of sensing elements arranged facing towards a front side of the biometric sensor. Further, the biometric sensor module comprises a bottom flexible film attached to a back side, opposite the front side, of the biometric sensor. The bottom flexible film can carry at least one electrically conductive line electrically connectable to the biometric sensor and electrically connectable to an external electrical circuit. The biometric sensor module further comprises a top film attached to the biometric sensor closer to the front side of the biometric sensor than the bottom flexible film. The flexible film includes a bent portion such that the flexible film is bent towards the top film.

Display panel, display apparatus, and method for preparing display panel

The embodiments of the present disclosure provide a display panel, a display device, and a method for manufacturing the display panel. The display panel comprises: a display module comprising a fingerprint recognition component; a packaging cover plate located on a light emergent side of the display module; and a plurality of light path adjustment devices located between the packaging cover plate and the fingerprint recognition component, wherein each of the light path adjustment devices comprises an optical fiber structure and a convex lens structure, which are arranged opposite each other, with the convex lens structure being located on the side of the optical fiber structure that is away from the packaging cover plate; and the light path adjustment devices are configured to adjust incident light reflected by a finger so as to reduce the angle of divergence of light entering the fingerprint recognition component.

Packaging for fingerprint sensors and methods of manufacture

A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.