Systems and techniques for tracking and providing real-time visualizations of maintenance time for datacenter components. The systems include sensors to detect when datacenter components are opened for maintenance, such as hot switching of hard drive disks, to initialize a countdown timer. Status indicator lights of components within the datacenter component are used to display visual representations of the countdown timer. The visualizations present a remaining or elapsed maintenance time remaining to ensure components of the datacenter component are not damaged by overheating during maintenance.

In some examples, an electronic device for mounting in a chassis includes a housing to be received in the chassis, and a mechanical intrusion indication segment to move from a retracted position to an extended position responsive to mounting of the housing in the electronic device. The mechanical intrusion indication segment when in the extended position is to break upon removal of the housing from the chassis. A controller is to detect an intrusion of the electronic device in response to breaking of the mechanical intrusion indication segment.

A point of sale (POS) device includes a flexible member with two exposed conductive areas that are part of a tamper detection circuit. While a recess receives a screw, the screw passes through apertures in the flexible member and in a conductive gasket, and the conductive gasket connects the two exposed conductive areas to one another, closing the tamper detection circuit. Adhesives affix the flexible member to the screw and the conductive gasket to the recess opening so that removing the screw from the recess separates the conductive gasket from the two exposed conductive areas, opening the tamper detection circuit.

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). The detector monitors the tamper-respondent sensor(s) by applying an electrical signal to the conductive lines of the at least one tamper-respondent sensor to monitor for a non-linear conductivity change indicative of a tamper event at the tamper-respondent sensor(s). For instance, the detector may monitor a second harmonic of the electrical signal applied to the conductive lines for the non-linear conductivity change indicative of the tamper event, such as an attempted shunt of one or more conductive lines of the tamper-respondent sensor(s).

Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.

An anti-tamper assembly is disclosed for a circuit board which comprises one or more electronic components. The assembly comprises a container having side walls, a first closed end and a second, opposing open end, the container being configured to be mounted on said circuit board at said open end, over at least one of the electronic components to form, in use, a sealed cavity around said at least one of said electronic components. The assembly further comprises a source of radioactive particles mounted within the container, an image sensor for capturing image frames within said sealed cavity, in use. The image sensor comprises a detector region defining an array of pixels, a screen member located, in use, within the cavity between the radioactive source and the detector, said screen member having at least one aperture, and a processor for retrieving said captured image frames, monitoring said image frames for changes in the statistical distribution of active pixels and, in the event that statistical distribution of active pixels indicates the presence of a feature in an image frame, generating a tamper alert.

Sensors, systems, and methods for data center security are provided. In one example, a data center monitoring system includes at least one sensor configured to be attached to a fixture in a data center. The sensor is configured to transmit a wireless signal for detecting an unauthorized access attempt to the fixture. The system also includes at least one monitoring device configured to communicate with the at least one sensor. The monitoring device is configured to receive a signal from the at least one sensor indicative of the unauthorized access attempt to the fixture.

It is described a tamper detection device for detecting tampering with respect to a packaging, the device comprising: i) a first electrode comprising a first patterned structure, and ii) a second electrode comprising a second patterned structure. The first electrode and the second electrode are arranged so that the first patterned structure and the second patterned structure are at least partially opposite to each other. In a first arrangement state of the first patterned structure and the second patterned structure with respect to each other, a first capacitance is measurable, in a second arrangement state of the first patterned structure and the second patterned structure with respect to each other, a second capacitance is measurable, wherein the first capacitance is different from the second capacitance, and wherein the first arrangement state is different from the second arrangement state. The device further comprising: iii) a detection unit, wherein the detection unit is configured to: a) measure the capacitance between the first electrode and the second electrode, b) obtain, based on the measured capacitance, an information indicative of the arrangement state, and c) evaluate, based on the information indicative of the arrangement state, if a tampering with respect to the packaging is detected.

This invention relates to an anti-tamper assembly for a circuit board comprising one or more electronic components, the assembly comprising: a container having side walls, a first, closed end and a second, opposing, open end, the container being configured to be mounted on said circuit board at said open end, over at least one of said electrical components, to form, in use, a sealed cavity around said at least one of said electrical components; a source of radioactive particles mounted within said container; an image sensor for capturing image frames within said sealed cavity, in use, wherein said image sensor comprises a detector region defining an array of pixels; and a processor for receiving said captured image frames, monitoring said image frames for changes in the statistical distribution of active pixels and, in the event that statistical distribution of active pixels indicates the presence of a feature in an image frame, generating a tamper alert.

A tamper sensor that includes a substrate and a conductive layer placed on the substrate. The tamper sensor also includes an insulation layer that is stacked on the conductive layer to form a layered tamper circuit. In addition, the substrate of the tamper sensor is the only substrate of the tamper sensor.