G11B11/24

Heatsink structures for heat-assisted magnetic recording heads

A recording head comprises a write pole extending to an air-bearing surface. A near-field transducer is positioned proximate a first side of the write pole in a down-track direction. A heatsink structure is proximate the near-field transducer and positioned between the near-field transducer and the write pole. The heatsink structure extends beyond the near-field transducer in a cross-track direction and extends in a direction normal to the air-bearing surface.

Heatsink structures for heat-assisted magnetic recording heads

A recording head comprises a write pole extending to an air-bearing surface. A near-field transducer is positioned proximate a first side of the write pole in a down-track direction. A heatsink structure is proximate the near-field transducer and positioned between the near-field transducer and the write pole. The heatsink structure extends beyond the near-field transducer in a cross-track direction and extends in a direction normal to the air-bearing surface.

Transfer-printed near-field transducer and heat sink

A near-field transducer or heat sink is formed via a first process. The near-field transducer or heat sink is transfer-printed to a read/write head via a second process.

HEATSINK STRUCTURES FOR HEAT-ASSISTED MAGNETIC RECORDING HEADS

A recording head comprises a write pole extending to an air-bearing surface. A near-field transducer is positioned proximate a first side of the write pole in a down-track direction. A heatsink structure is proximate the near-field transducer and positioned between the near-field transducer and the write pole. The heatsink structure extends beyond the near-field transducer in a cross-track direction and extends in a direction normal to the air-bearing surface.

HEATSINK STRUCTURES FOR HEAT-ASSISTED MAGNETIC RECORDING HEADS

A recording head comprises a write pole extending to an air-bearing surface. A near-field transducer is positioned proximate a first side of the write pole in a down-track direction. A heatsink structure is proximate the near-field transducer and positioned between the near-field transducer and the write pole. The heatsink structure extends beyond the near-field transducer in a cross-track direction and extends in a direction normal to the air-bearing surface.

Heat-assisted magnetic recording (HAMR) head with tapered main pole and heat sink material adjacent the pole

A heat-assisted magnetic recording (HAMR) head for recording data in data tracks of a HAMR disk has a gas-bearing slider that supports a near-field transducer (NFT) and a main magnetic pole formed of two layers. The first main pole layer has a cross-track width at the slider's gas-bearing surface (GBS) that tapers down in the direction towards the NFT where the optical spot is formed. The second main pole layer is located away from the NFT and has a substantially wider cross-track width than the first main pole layer so as to provide sufficient magnetic field for writing. Layers of heat sink material are located on the sloped cross-track sides of the tapered first main pole layer to reduce the temperature and thus the likelihood of oxidation of the main pole layers.

Heat-assisted magnetic recording (HAMR) head with tapered main pole and heat sink material adjacent the pole

A heat-assisted magnetic recording (HAMR) head for recording data in data tracks of a HAMR disk has a gas-bearing slider that supports a near-field transducer (NFT) and a main magnetic pole formed of two layers. The first main pole layer has a cross-track width at the slider's gas-bearing surface (GBS) that tapers down in the direction towards the NFT where the optical spot is formed. The second main pole layer is located away from the NFT and has a substantially wider cross-track width than the first main pole layer so as to provide sufficient magnetic field for writing. Layers of heat sink material are located on the sloped cross-track sides of the tapered first main pole layer to reduce the temperature and thus the likelihood of oxidation of the main pole layers.

HEAT-ASSISTED MAGNETIC RECORDING (HAMR) HEAD WITH TAPERED MAIN POLE AND HEAT SINK MATERIAL ADJACENT THE POLE

A heat-assisted magnetic recording (HAMR) head for recording data in data tracks of a HAMR disk has a gas-bearing slider that supports a near-field transducer (NFT) and a main magnetic pole formed of two layers. The first main pole layer has a cross-track width at the slider's gas-bearing surface (GBS) that tapers down in the direction towards the NFT where the optical spot is formed. The second main pole layer is located away from the NFT and has a substantially wider cross-track width than the first main pole layer so as to provide sufficient magnetic field for writing. Layers of heat sink material are located on the sloped cross-track sides of the tapered first main pole layer to reduce the temperature and thus the likelihood of oxidation of the main pole layers.

HEAT-ASSISTED MAGNETIC RECORDING (HAMR) HEAD WITH TAPERED MAIN POLE AND HEAT SINK MATERIAL ADJACENT THE POLE

A heat-assisted magnetic recording (HAMR) head for recording data in data tracks of a HAMR disk has a gas-bearing slider that supports a near-field transducer (NFT) and a main magnetic pole formed of two layers. The first main pole layer has a cross-track width at the slider's gas-bearing surface (GBS) that tapers down in the direction towards the NFT where the optical spot is formed. The second main pole layer is located away from the NFT and has a substantially wider cross-track width than the first main pole layer so as to provide sufficient magnetic field for writing. Layers of heat sink material are located on the sloped cross-track sides of the tapered first main pole layer to reduce the temperature and thus the likelihood of oxidation of the main pole layers.

THIN-FILM CRYSTALLINE STRUCTURE WITH SURFACES HAVING SELECTED PLANE ORIENTATIONS
20220051694 · 2022-02-17 ·

A method of forming a thin film structure involves performing one or more repetitions to form a template on a wafer. The repetitions include: depositing a layer of a template material to a first thickness T1; and ion beam milling the layer of the template material to remove thickness T2, where T2<T1, resulting in a layer of the template material with thickness T1−T2. The ion beam milling is performed at a channeling angle relative to a deposition plane of the wafer, the channeling angle defined relative to a channeling direction of a crystalline microstructure of the template material. After the repetitions, additional material is deposited on the template to form a final structure. The additional material has a same crystalline microstructure as the template material.