In a MEMS device in which a first electrode layer, a piezoelectric layer, and a second electrode layer are stacked in this order from a first surface side of a substrate, a first wiring layer is stacked on a second surface on a side opposite to a first surface of the substrate and the first electrode layer and the first wiring layer are connected to each other via a through wiring passing through the substrate.

A record player capable of playing phonographic records that may be played in a scratch style by a user. The record player includes a tonearm that is rotatably supported at or near an end of the tonearm by a structure having both horizontally and vertically fastening points to the tonearm. The fastening points are configured to receive a user activated tension adjustment element. A user may advance or retreat the tension adjustment element to selectably control the positioning, or relative tension in the tonearm such that any record skipping due to undesirable tonearm pressure is controlled, or to achieve a specific sound.

A record player capable of playing phonographic records that may be played in a scratch style by a user. The record player includes a tonearm that is rotatably supported at or near an end of the tonearm by a structure having both horizontally and vertically fastening points to the tonearm. The fastening points are configured to receive a user activated tension adjustment element. A user may advance or retreat the tension adjustment element to selectably control the positioning, or relative tension in the tonearm such that any record skipping due to undesirable tonearm pressure is controlled, or to achieve a specific sound.

A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.

A pseudo feature for a suspension and method of manufacture are described. The pseudo feature for a suspension includes a first constraining layer; a second constraining layer; and a damping layer arranged between the first constraining layer and the second constraining layer.

A hard disk drive (HDD) includes a suspension connected to a stack arm. The suspension includes a mount plate, a hinge, a load beam, and a circuit. The mount plate includes a bottom surface facing a disk and an ear portion extending from a side edge of the mount plate. The bottom surface includes a planar region, a first indented region vertically recessed relative to the planar region, and a second indented region located at the ear portion and vertically recessed relative to the planar region. The load beam terminates in a load beam hinge is connected to the first indented region. The circuit extends along the first and second indented regions.

A hard disk drive (HDD) includes a suspension connected to a stack arm. The suspension includes a mount plate, a hinge, a load beam, and a circuit. The mount plate includes a bottom surface facing a disk and an ear portion extending from a side edge of the mount plate. The bottom surface includes a planar region, a first indented region vertically recessed relative to the planar region, and a second indented region located at the ear portion and vertically recessed relative to the planar region. The load beam terminates in a load beam hinge is connected to the first indented region. The circuit extends along the first and second indented regions.

A base member includes a projection having a cylindrical shape and projecting in an axial direction and a component placement part. The projection and the component placement part are adjacent to each other via a curved surface part having a first curved surface and a second curved surface. The first curved surface and the second curved surface have a diameter increasing toward the component placement part in the axial direction. The second curved surface is located closer to a side of the component placement part than the first curved surface in the axial direction.