A modular data storage tape library includes a modular frame having a form factor similar to other types of computing racks. The modular data storage tape library includes a hermetically sealed enclosure within the modular frame and a cooling portion within the modular frame. Data storage tapes, data storage drives and robotics for moving the data storage tapes are included within the hermetically sealed enclosure. A heat exchanger transfers heat from the hermetically sealed enclosure to the cooling portion outside of the sealed enclosure through a boundary of the hermetically sealed enclosure without introducing air from the data center into the hermetically sealed enclosure. Because air is neither introduced nor removed from the hermetically sealed enclosure, humidity fluctuations are minimal, if existent, and contaminants are prevented from entering the hermetically sealed enclosure, thus increasing the life spans of the data storage tapes included in the hermetically sealed enclosure.

One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.

A motor includes a shaft, a base, a stator, a rotor, a bearing, and at least one or more temperature adjusters. The shaft extends along a central axis extending in an axial direction. The base extends in a radial direction from an end of the shaft in an axially one direction. The stator has an annular shape surrounding the shaft, and is disposed further in an axially other direction than the base. The rotor is rotatable about the central axis. The bearing rotatably supports the rotor. The temperature adjuster adjusts an ambient temperature of the bearing. The shaft has a shaft hole recessed in the axial direction from an axial end of the shaft. The temperature adjuster is disposed in the shaft hole and overlaps at least a portion of the bearing as viewed in the radial direction.

A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.

Methods, apparatuses, and systems related to a memory device are described. A controller may be configured to predict a temperature of a memory based on a real-time temperature of the controller. Based on the predicted temperature of the memory, the controller may execute a remedial action to reduce an actual temperature of the memory for executing an upcoming operation.

A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.

Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.

Embodiments of the present disclosure generally relate to housings for, e.g., memory devices and electronic devices, and to processes for forming such housings. In an embodiment, an article for housing at least a portion of an electronic device is provided. The article includes a first component comprising a thermoplastic and a biodegradable filler or polymer, and a second component disposed on at least a portion of the first component, the second component comprising a plurality of layers. The article has a scratch visibility load of about 200 gms or more, an electrostatic discharge static voltage of about 100 V or less, a thermal conductivity of about 0.28 W/mK or more, or combinations thereof.

A cartridge module alignment and mounting system, apparatus and method for mounting of a plurality of removable modules where the modules can be densely packed within the apparatus and where physical alignment of the module is maintained during insertion and removal so that the modules are easily connected or disconnected to a printed circuit board. The system includes an alignment pin affixable to the printed circuit board, and a carrier attachable to an electronic device such as a data storage device. The carrier can include a pin bore configured to receive a portion of the alignment pin thereby removably connecting and aligning the electronic device to the printed circuit board so that a space is defined between adjacent electronic devices. The space allows airflow or fluid flow to pass therebetween increasing heat dissipation of the electronic devices and the printed circuit board.

A video coder is configured to form, in a symmetric motion vector difference mode, a List 0 (L0) base vector using a L0 Advanced Motion Vector Prediction (AMVP) candidate list and a List 1 (L1) base vector using a L1 AMVP candidate list; determine a refined L0 motion vector and a refined L1 motion vector by performing a decoder-side motion vector refinement process that refines the L0 base vector and the L1 base vector; and use the refined L0 motion vector and the refined L1 motion vector to determine a prediction block for a current block of a current picture of the video data.