A magnetic recording head assembly is provided and is configured to read from and write to a magnetic media. The head assembly includes a first module having a first media facing surface (MFS), a first closure, and a first recessed portion disposed between the first MFS and the first closure. The first MFS includes AlTiC. A second module is provided having a second MFS, a second closure, and a second recessed portion disposed between the second MFS and the second closure. The second MFS includes AlTiC. An overcoat disposed within the first and second recessed portions includes an adhesive layer and a protective layer disposed within the first and second recessed portion.

A near-field transducer or heat sink is formed via a first process. The near-field transducer or heat sink is transfer-printed to a read/write head via a second process.

The present disclosure is generally related to a tape head assembly narrower than the width of a tape, wherein the tape head assembly comprises one or more heads, wherein each of the one or more heads comprise a curved surface comprising a first beveled wing, a second beveled wing, and a flat-lapped surface disposed between the first beveled wing and the second beveled wing. The first beveled wing and the second beveled wing each comprise outer corners recessed from a top surface of the flat-lapped surface such that there is no interaction between the outer corners of the beveled wings and the tape.

A plurality of transducer bars may be concurrently translated from a first orientation to a second orientation by a translation system that has first and second plates. The first plate can have a plurality of first notches with each first notch shaped to hold a transducer bar in a horizontal orientation. The second plate can have a plurality of second notches with each second notch shaped to translate the transducer bar from the horizontal orientation to a vertical orientation.

A magnetic recording head assembly is provided and is configured to read from and write to a magnetic media. The head assembly includes a first module having a first media facing surface (MFS), a first closure, and a first recessed portion disposed between the first MFS and the first closure. The first MFS includes AlTiC. A second module is provided having a second MFS, a second closure, and a second recessed portion disposed between the second MFS and the second closure. The second MFS includes AlTiC. An overcoat disposed within the first and second recessed portions includes an adhesive layer and a protective layer disposed within the first and second recessed portion.

A method comprises forming a single-crystal-like metal layer on a metal seed layer, the metal seed layer formed on a carrier wafer. The method comprises forming a first bonding layer on the single-crystal-like metal layer. The method also comprises forming a second bonding layer on a dielectric layer of a target substrate, the target substrate comprising one or more recording head subassemblies. The bonding layers may include diffusion layers or dielectric bonding layers. The method further comprises flipping and joining the carrier wafer with the target substrate such that the first and second diffusion layers are bonded and the single-crystal-like metal layer is integrated with the recording head as a near-field transducer.

A thermally-assisted magnetic recording head includes a main pole and a plasmon generator. The main pole has a front end face located in the medium facing surface. The plasmon generator has a near-field light generating surface located in the medium facing surface. The front end face of the main pole includes a first end face portion and a second end face portion. The second end face portion is located farther from the near-field light generating surface than is the first end face portion, and is greater than the first end face portion in width in the track width direction. The first end face portion and the near-field light generating surface are equal in width.

A thermally-assisted magnetic recording head includes a main pole and a plasmon generator. The plasmon generator includes a first material portion and a second material portion formed of different materials. The first material portion is located away from the medium facing surface. The second material portion includes a near-field light generating surface. The main pole has a front end face including a first end face portion and a second end face portion. The near-field light generating surface, the first end face portion and the second end face portion are arranged in this order along the direction of travel of a recording medium.

A method provides a magnetic transducer having a media-facing surface (MFS). The method includes providing a pole, providing a side gap, providing coil(s) for energizing the pole and providing side shield(s). A portion of the pole resides at the MFS. The side gap is between the pole and the side shield(s). The side shield(s) have a gradient in a saturation magnetization such that the saturation magnetization increases in a yoke direction perpendicular to the MFS. The step of providing the side shield(s) further includes providing a nonmagnetic structure having a side surface parallel to the MFS and providing at least one side shield layer. A portion of the side shield layer(s) are on the side surface. The portion of the side shield layer(s) has the gradient in the saturation magnetization. At least part of the side shield being formed by the portion of the side shield layer(s).

A tape head including a body with a tape-bearing surface configured to contact a magnetic tape, at least one transducer that is a read or write element, configured so the tape head may read from or write to the tape, in operation; and a monobloc closure with a structured cross-sectional profile, so as to exhibit: contact part, fixed on a side of the body which adjoins the tape-bearing surface at an edge thereof, the contact part having a top surface level with the tape-bearing surface; and connecting part integral with the contact part, the connecting part having a top surface recessed from the contact part's top surface, perpendicularly to a contact plane defined by said tape-bearing surface, so the connecting part's top surface does not contact the tape, in operation; and a broken line of mechanical weakness that extends at an end of said third surface.