The present invention is directed to the fabrication of head sliders for use in hard disk drives, and in particular the provision and usage of electrical bond pads on the slider surface structure to accommodate needs of the fabrication process as well as slider operation within a disk drive.

The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.

The present invention is directed to the fabrication of head sliders for use in hard disk drives, and in particular the provision and usage of electrical bond pads on the slider surface structure to accommodate needs of the fabrication process as well as slider operation within a disk drive.

A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

A magnetic tape recording module having electrical lapping guides located within and adjacent to an array of magnetic read/write elements. Electrical leads connected with the electrical lapping guides are buried deep within the head build, close to the substrate so that they can pass beneath the electrical leads of the read/write elements without any capacitive coupling between the electrical lapping guide leads and the read/write element leads. The presence of the electrical lapping guides within and adjacent to the read/write element leads provides much more accurate control of read/write element stripe height during lapping.

In one general embodiment, a method includes forming a slot on a tape bearing surface of at least a chip having a thin film layer with a plurality of transducers therein, the slot defining a skiving edge. A second operation is performed on the tape bearing surface of at least the chip for removing a portion of the chip positioned on an opposite side of the slot as the transducers. In another general embodiment, an apparatus includes a substrate, a thin film layer on the substrate having transducers therein, and a portion of a slot extending along the substrate, the portion of the slot defining a skiving edge. A length of a tape bearing surface between the substrate and the skiving edge is in a range of about 7 to about 30 microns.

A method according to one embodiment includes coupling closures to a section having a plurality of rows of transducers formed on a substrate, the closures being coupled to the section on an opposite side of the transducers as the substrate. The section is coupled to a lapping-resistant guide, where the closures protrude beyond a lap-stop end of the guide. The closures are lapped for shortening the closures in a direction toward the transducers, wherein the lapping is terminated after the guide contacts a lapping surface. A method according to another embodiment includes coupling closures to a section having a plurality of rows of transducers formed on a substrate. The closures are lapped for shortening the closures in a direction toward the transducers. An extent of the lapping is determined using an optical and/or a contact technique.

A tape head including a body with a tape-bearing surface configured to contact a magnetic tape, at least one transducer that is a read or write element, configured so the tape head may read from or write to the tape, in operation; and a monobloc closure with a structured cross-sectional profile, so as to exhibit: contact part, fixed on a side of the body which adjoins the tape-bearing surface at an edge thereof, the contact part having a top surface level with the tape-bearing surface; and connecting part integral with the contact part, the connecting part having a top surface recessed from the contact part's top surface, perpendicularly to a contact plane defined by said tape-bearing surface, so the connecting part's top surface does not contact the tape, in operation; and a broken line of mechanical weakness that extends at an end of said third surface.

A tape head is provided for reading and/or writing to a magnetic tape. The tape head including a step-like cross-sectional profile, so as to exhibit a riser between two treads, the latter respectively formed by a tape-bearing surface and a recessed surface, wherein: the tape-bearing surface is essentially flat and configured to contact a magnetic tape, and comprises at least one transducer, the latter being a read or a write element, configured to read or write to the magnetic tape, respectively; and the recessed surface is recessed from the tape-bearing surface by a distance h corresponding to a height of the riser, a width w of the recessed surface along a direction parallel to a longitudinal direction z of circulation of the tape being such that a ratio h/w is at least of 0.01. Related tape head apparatuses for recording or reproducing multi-track tapes are also provided.

A data writer can have at least a write pole separated from a return pole by a non-magnetic lamination. The non-magnetic lamination may consist of first, second, and third non-magnetic materials that are each different and configured to provide a physical protrusion on an air bearing surface of less than 4 Angstroms.