A hard disk drive head slider is configured with a material void, such as a chamfer, positioned at a virtual intersection of a leading edge (LE) face and a suspension face. The material void provides for avoidance of structural interference between an actuator that is mechanically coupled with the slider and the suspension flexure during actuator operation, thereby enabling the actuator to achieve a full desired stroke.

A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

Disclosed herein are methods of forming one or more transducer elements in a transducer region of a slider by electrodepositing one or more metal ions from an ionic liquid solvent, and related sliders.

A method of providing an apparatus with a protective layer by simultaneously depositing carbon and seed material on the apparatus to form an intermediate layer, wherein the carbon and seed material have a percentage composition that varies as a function of the intermediate layer thickness; and then providing a diamond-like carbon (DLC) layer adjacent to the intermediate layer to produce the protective layer.

In one general embodiment, a method includes forming a slot on a tape bearing surface of at least a chip having a thin film layer with a plurality of transducers therein, the slot defining a skiving edge. A second operation is performed on the tape bearing surface of at least the chip for removing a portion of the chip positioned on an opposite side of the slot as the transducers. In another general embodiment, an apparatus includes a substrate, a thin film layer on the substrate having transducers therein, and a portion of a slot extending along the substrate, the portion of the slot defining a skiving edge. A length of a tape bearing surface between the substrate and the skiving edge is in a range of about 7 to about 30 microns.

A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

A slider comprises an air bearing surface having a leading edge at a first end of the air bearing surface; a trailing edge at a second end of the air bearing surface, wherein the first end is opposite to the second end; a first region adjacent to the trailing edge, wherein the first region comprises one or more transducer elements; and a second region adjacent to the first region and the leading edge. The air bearing surface has a protective overcoat layer as an outermost layer, wherein the protective overcoat layer extends across the entire air bearing surface. The air bearing surface comprises a lapped surface and a plurality of milled surfaces, wherein a surface potential difference between the lapped surface and a milled surface is 0+/−50 milliVolts or less as measured according to Kelvin Probe Force Microscopy (KPFM).

The present disclosure relates to kiss lapping sliders after patterning an air bearing surface pattern, followed by applying a protective overcoat to the air bearing surface. The present disclosure also involves related sliders.

A high density slider clamp fixture is disclosed for accurately positioning a large number of head sliders for metrology testing. The slider clamp fixture may include a single piece, monolithic structure comprising a large number of slider nests, aligned in rows and columns in the slider fixture. Each slider nest includes a reference datum surface machined to precisely align with all other reference datum surfaces in a row of the monolithic structure. Each slider nest further includes a flexure clamp for independent clamping of each slider in the row against the reference datum surfaces.

The present disclosure relates to kiss lapping sliders after patterning an air bearing surface pattern, followed by applying a protective overcoat to the air bearing surface. The present disclosure also involves related sliders.