Methods, devices, and systems related to storing parity data in dynamic random access memory (DRAM) are described. In an example, a method can include generating, at a controller, parity data based on user data queued for writing to a non-volatile memory device, receiving the parity data at a DRAM device from the controller and writing the parity data to the DRAM device, receiving the user data at a non-volatile memory device from the controller and writing the user data to the non-volatile memory device, reading the user data from the non-volatile memory device via the controller, and receiving the parity data at the controller from the DRAM device.

This disclosure relates to a method for situation-dependent storage of data of a system, in which data of the system is detected, is amalgamated in at least one data block and is stored in a volatile memory, and in which, in response to the occurrence of at least one predefined trigger event in the at least one data block, amalgamated data are transferred from the volatile memory into a read-only memory, and in which a time window, in which the data for the at least one data block is captured, is selected automatically and dynamically according to the at least one trigger event.

A method includes determining a first memory access count threshold for a first word line of a block of memory cells and determining a second memory access count threshold for a second word line of the block of memory cells. The second memory access count threshold can be greater than the first memory access count threshold. The method can further include incrementing a memory block access count corresponding to the block of memory cells that includes the first word line and the second word line in response to receiving a memory access command and refreshing the first word line when the memory block access count corresponding to the block of memory cells is equal to the first memory access count threshold.

A memory device includes a plurality of magnetoresistive random-access memory (MRAM) cells including a first one-time programmable (OTP) MRAM cell. A first OTP select transistor is connected to the first OTP MRAM cell. The first OTP select transistor configured to selectively apply a breakdown current to the first OTP MRAM cell to write the first OTP MRAM cell to a breakdown state.

A multi-chip package includes a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip configured to perform a logic function based on a truth table, wherein the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip comprises multiple non-volatile memory cells therein configured to store multiple resulting values of the truth table, and a programmable logic block therein configured to select, in accordance with one of the combinations of its inputs, one from the resulting values into its output; and a memory chip coupling to the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip, wherein a data bit width between the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip and the memory chip is greater than or equal to 64.

First semiconductor structures are formed on a first wafer. At least one of the first semiconductor structures includes a programmable logic device, an array of static random-access memory (SRAM) cells, and a first bonding layer including first bonding contacts. Second semiconductor structures are formed on a second wafer. At least one of the second semiconductor structures includes an array of NAND memory cells and a second bonding layer including second bonding contacts. The first wafer and the second wafer are bonded in a face-to-face manner, such that the at least one of the first semiconductor structures is bonded to the at least one of the second semiconductor structures. The first bonding contacts of the first semiconductor structure are in contact with the second bonding contacts of the second semiconductor structure at a bonding interface. The bonded first and second wafers are diced into dies. At least one of the dies includes the bonded first and second semiconductor structures.

A non-volatile semiconductor memory device includes a memory array 20, including a plurality of memory elements; a selection part, selecting the memory elements of the memory array based on address data; a mode selection part 30, selecting any one of a RAM mode and a flash mode, where the RAM mode is a mode adapted to overwrite data of the memory element according to writing data, and the flash mode is a mode adapted to overwrite data of the memory element when the writing data is a first value and prohibit overwrite when the writing data is a second value; and a write control part, writing the writing data to the selected memory element according to the RAM mode or the flash mode selected by the mode selection part 30.

A circuit includes an operational amplifier including an inverting input terminal capacitively coupled to each of an OTP cell array and an NVM cell array and first and second output terminals, an ADC coupled to the first and second output terminals, thereby configured to receive a differential output voltage from the operational amplifier, and a comparator coupled to the ADC and configured to output a data bit responsive to a digital output signal received from the ADC. The circuit is configured to cause the operational amplifier to generate the differential output voltage based on each of a current received from an OTP cell of the OTP cell array and a voltage received from an NVM cell of the NVM cell array.

Techniques are provided for operating a memory package and more specifically to increasing bandwidth of a system having stacked memory. In an example, a system can include a storage device having a first type of volatile memory and a second type of volatile memory, and a host device coupled to the storage device. The host device can issue commands to the storage device to store and retrieve information of the system. The host device can include a memory map of the storage device and latency information associated with each command of the commands. The host can sort and schedule pending commands according to the latency information and can intermix commands for the first type of volatile memory and commands for the second type of volatile memory to maintain a high utilization or efficiency of a data interface between the host device and the storage device.

Semiconductor devices including vertically-stacked combination memory devices and associated systems and methods are disclosed herein. The vertically-stacked combination memory devices include at least one volatile memory die and at least one non-volatile memory die stacked on top of each other. The corresponding stack may be attached to a controller die that is configured to provide interface for the attached volatile and non-volatile memory dies.