A memory cell in capacitive logic, including a bistable system including a fixed element and a mobile element capable of taking one or the other of two stable positions with respect to the fixed element; a read device including a variable-capacitance capacitor including a first fixed electrode and a second mobile electrode rigidly fixed to the mobile element; and an electrically controllable write device for placing the mobile element in one or the other of its two stable positions.

A memory cell in capacitive logic, including a bistable system including a fixed element and a mobile element capable of taking one or the other of two stable positions with respect to the fixed element; a read device including a variable-capacitance capacitor including a first fixed electrode and a second mobile electrode rigidly fixed to the mobile element; and an electrically controllable write device for placing the mobile element in one or the other of its two stable positions.

A memory cell in capacitive logic, including a bistable system including a fixed element and a mobile element capable of taking one or the other of two stable positions with respect to the fixed element; a read device including a variable-capacitance capacitor including a first fixed electrode and a second mobile electrode rigidly fixed to the mobile element; and an electrically controllable write device for placing the mobile element in one or the other of its two stable positions.

A memory cell in capacitive logic, including a bistable system including a fixed element and a mobile element capable of taking one or the other of two stable positions with respect to the fixed element; a read device including a variable-capacitance capacitor including a first fixed electrode and a second mobile electrode rigidly fixed to the mobile element; and an electrically controllable write device for placing the mobile element in one or the other of its two stable positions.

Integrated circuits with an array of programmable resistive switch elements are provided. A programmable resistive switch element may include two non-volatile resistive memory elements connected in series and two varistors. A first of the two varistors is used to program a top resistive memory element in the resistive switch element, whereas a second of the two varistors is used to program a bottom resistive memory element in the resistive switch element. Row and column drivers implemented using only thin gate oxide transistors are used to program a selected resistive switch in the array without violating a maximum voltage level that satisfies predetermined defects per million (DPM) reliability criteria.

Integrated circuits with an array of programmable resistive switch elements are provided. A programmable resistive switch element may include two non-volatile resistive memory elements connected in series and two varistors. A first of the two varistors is used to program a top resistive memory element in the resistive switch element, whereas a second of the two varistors is used to program a bottom resistive memory element in the resistive switch element. Row and column drivers implemented using only thin gate oxide transistors are used to program a selected resistive switch in the array without violating a maximum voltage level that satisfies predetermined defects per million (DPM) reliability criteria.

Integrated circuits with an array of programmable resistive switch elements are provided. A programmable resistive switch element may include two non-volatile resistive memory elements connected in series and two varistors. A first of the two varistors is used to program a top resistive memory element in the resistive switch element, whereas a second of the two varistors is used to program a bottom resistive memory element in the resistive switch element. Row and column drivers implemented using only thin gate oxide transistors are used to program a selected resistive switch in the array without violating a maximum voltage level that satisfies predetermined defects per million (DPM) reliability criteria.

Integrated circuits with an array of programmable resistive switch elements are provided. A programmable resistive switch element may include two non-volatile resistive memory elements connected in series and two varistors. A first of the two varistors is used to program a top resistive memory element in the resistive switch element, whereas a second of the two varistors is used to program a bottom resistive memory element in the resistive switch element. Row and column drivers implemented using only thin gate oxide transistors are used to program a selected resistive switch in the array without violating a maximum voltage level that satisfies predetermined defects per million (DPM) reliability criteria.

A magnetic memory device includes a spin-orbit interaction active core having a number of layers stacked along a longitudinal axis and a magnetic junction extending around the longitudinal axis and substantially surrounding at least a portion of the spin-orbit interaction active core. The magnetic junction includes a free layer, a reference layer, and a tunnel barrier layer between the free layer and the reference layer.

A magnetic memory device includes a spin-orbit interaction active core having a number of layers stacked along a longitudinal axis and a magnetic junction extending around the longitudinal axis and substantially surrounding at least a portion of the spin-orbit interaction active core. The magnetic junction includes a free layer, a reference layer, and a tunnel barrier layer between the free layer and the reference layer.