G11C11/36

Dynamic random access memory (DRAM) cell, DRAM device and storage method

A DRAM cell includes a transistor, a first diode and a second diode. The transistor has a gate electrically coupled to a word line of an address decoder and a drain electrically coupled to a bit line of the address decoder. The bit line is coupled to a power supply voltage. An anode and a cathode of the first diode are coupled to a cathode and an anode of the second diode, respectively. Each of the first diode and the second diode is coupled at a first end to a source of the transistor at a first node, and at a second end to a node voltage at the second node. A DRAM device includes an address decoder and DRAM cells. A storage method for a DRAM device includes writing data into the DRAM cells and reading data from the DRAM cells.

Dynamic random access memory (DRAM) cell, DRAM device and storage method

A DRAM cell includes a transistor, a first diode and a second diode. The transistor has a gate electrically coupled to a word line of an address decoder and a drain electrically coupled to a bit line of the address decoder. The bit line is coupled to a power supply voltage. An anode and a cathode of the first diode are coupled to a cathode and an anode of the second diode, respectively. Each of the first diode and the second diode is coupled at a first end to a source of the transistor at a first node, and at a second end to a node voltage at the second node. A DRAM device includes an address decoder and DRAM cells. A storage method for a DRAM device includes writing data into the DRAM cells and reading data from the DRAM cells.

Gated diode memory cells
10797053 · 2020-10-06 · ·

Examples relate generally to the field of semiconductor memory devices. In an example, a memory cell may include an access device coupled to an access line and a gated diode coupled to the access device. The gated diode may include a gate stack structure that includes a direct tunneling material, a trapping material, and a blocking material.

Gated diode memory cells
10797053 · 2020-10-06 · ·

Examples relate generally to the field of semiconductor memory devices. In an example, a memory cell may include an access device coupled to an access line and a gated diode coupled to the access device. The gated diode may include a gate stack structure that includes a direct tunneling material, a trapping material, and a blocking material.

DYNAMIC RANDOM ACCESS MEMORY (DRAM) CELL, DRAM DEVICE AND STORAGE METHOD
20200286540 · 2020-09-10 ·

A DRAM cell includes a transistor, a first diode and a second diode. The transistor has a gate electrically coupled to a word line of an address decoder and a drain electrically coupled to a bit line of the address decoder. The bit line is coupled to a power supply voltage. An anode and a cathode of the first diode are coupled to a cathode and an anode of the second diode, respectively. Each of the first diode and the second diode is coupled at a first end to a source of the transistor at a first node, and at a second end to a node voltage at the second node. A DRAM device includes an address decoder and DRAM cells. A storage method for a DRAM device includes writing data into the DRAM cells and reading data from the DRAM cells.

DYNAMIC RANDOM ACCESS MEMORY (DRAM) CELL, DRAM DEVICE AND STORAGE METHOD
20200286540 · 2020-09-10 ·

A DRAM cell includes a transistor, a first diode and a second diode. The transistor has a gate electrically coupled to a word line of an address decoder and a drain electrically coupled to a bit line of the address decoder. The bit line is coupled to a power supply voltage. An anode and a cathode of the first diode are coupled to a cathode and an anode of the second diode, respectively. Each of the first diode and the second diode is coupled at a first end to a source of the transistor at a first node, and at a second end to a node voltage at the second node. A DRAM device includes an address decoder and DRAM cells. A storage method for a DRAM device includes writing data into the DRAM cells and reading data from the DRAM cells.

Transposable feedback field-effect electronic device and array circuit using the same

The present disclosure discloses a transposable feedback field-effect electronic device and an array circuit using the feedback field-effect electronic device. According to one embodiment of the present disclosure, the feedback field-effect electronic device may include a diode structure, a plurality of gate electrodes, and a plurality of access electronic devices, wherein, when the diode structure receives voltage through a first gate electrode of the gate electrodes and a first access electronic device of the access electronic devices, first direction access may be performed, and when the diode structure receives voltage through a second gate electrode of the gate electrodes and a second access electronic device of the access electronic devices, second direction access may be performed.

Concurrent multi-state program verify for non-volatile memory

A sense amplifier for a memory circuit that can sense into the deep negative voltage threshold region is described. A selected memory cell is sensed by discharging a source line through the memory cell into the bit line and sense amplifier. While discharging the source line through the memory cell into the sense amplifier, a voltage level on the discharge path is used to set the conductivity of a discharge transistor to a level corresponding to the conductivity of the selected memory cell. A sense node is then discharged through the discharge transistor. By allowing the sense amplifier to bias a memory cell being sensed to a selected one of multiple bias levels during a sensing operation, multiple target data states can be concurrently program verified, leading to higher performance when writing data.

Concurrent multi-state program verify for non-volatile memory

A sense amplifier for a memory circuit that can sense into the deep negative voltage threshold region is described. A selected memory cell is sensed by discharging a source line through the memory cell into the bit line and sense amplifier. While discharging the source line through the memory cell into the sense amplifier, a voltage level on the discharge path is used to set the conductivity of a discharge transistor to a level corresponding to the conductivity of the selected memory cell. A sense node is then discharged through the discharge transistor. By allowing the sense amplifier to bias a memory cell being sensed to a selected one of multiple bias levels during a sensing operation, multiple target data states can be concurrently program verified, leading to higher performance when writing data.

TRANSPOSABLE FEEDBACK FIELD-EFFECT ELECTRONIC DEVICE AND ARRAY CIRCUIT USING THE SAME

The present disclosure discloses a transposable feedback field-effect electronic device and an array circuit using the feedback field-effect electronic device. According to one embodiment of the present disclosure, the feedback field-effect electronic device may include a diode structure, a plurality of gate electrodes, and a plurality of access electronic devices, wherein, when the diode structure receives voltage through a first gate electrode of the gate electrodes and a first access electronic device of the access electronic devices, first direction access may be performed, and when the diode structure receives voltage through a second gate electrode of the gate electrodes and a second access electronic device of the access electronic devices, second direction access may be performed.